LED Lamps. HLMT-PH00 Datasheet

HLMT-PH00 Lamps. Datasheet pdf. Equivalent


Agilent(Hewlett-Packard) HLMT-PH00
H
Subminiature High Performance
AlInGaP LED Lamps
Technical Data
SunPower Series
HLMA-PH00 HLMT-PH00
HLMA-PL00 HLMT-PL00
HLMA-QH00 HLMT-QH00
HLMA-QL00 HLMT-QL00
Features
Subminiature Flat Top
Package
Ideal for Backlighting and Light
Piping Applications
Subminiature Dome Package
Nondiffused Dome for High
Brightness
• Wide Range of Drive
Currents
• Colors: 590 nm Amber,
615 nm Reddish-Orange
• Ideal for Space Limited
Applications
• Axial Leads
• Available with Lead
Configurations for Surface
Mount and Through Hole PC
Board Mounting
Description
Flat Top Package
The HLMX-PXXX flat top lamps
use an untinted, nondiffused,
truncated lens to provide a wide
radiation pattern that is necessary
for use in backlighting applica-
tions. The flat top lamps are also
ideal for use as emitters in light
pipe applications.
Dome Packages
The HLMX-QXXX dome lamps use
an untinted, nondiffused lens to
provide a high luminous intensity
within a narrow radiation pattern.
Lead Configurations
All of these devices are made by
encapsulating LED chips on axial
lead frames to form molded epoxy
subminiature lamp packages. A
variety of package configuration
options is available. These include
special surface mount lead
configurations, gull wing, yoke
lead, or Z-bend. Right angle lead
bends at 2.54 mm (0.100 inch)
and 5.08 mm (0.200 inch) center
spacing are available for through
hole mounting. For more infor-
mation refer to Standard SMT and
Through Hole Lead Bend Options
for Subminiature LED Lamps data
sheet.
Technology
These subminiature solid state
lamps utilize one of the two newly
developed aluminum indium
gallium phosphide (AlInGaP) LED
technologies, either the absorbing
substrate carrier technology (AS
= HLMA-Devices) or the
transparent substrate carrier
technology (TS = HLMT-
Devices). The TS HLMT-Devices
are especially effective in very
bright ambient lighting condi-
tions. The colors 590 nm amber
and 615 nm reddish-orange are
available with viewing angles of
15° for the domed devices and
125° for the flat top devices.
5964-9364E
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HLMT-PH00 Datasheet
Recommendation HLMT-PH00 Datasheet
Part HLMT-PH00
Description Subminiature High Performance AlInGaP LED Lamps
Feature HLMT-PH00; H Subminiature High Performance AlInGaP LED Lamps Technical Data SunPower Series HLMA-PH00 HLMT-PH0.
Manufacture Agilent(Hewlett-Packard)
Datasheet
Download HLMT-PH00 Datasheet




Agilent(Hewlett-Packard) HLMT-PH00
Device Selection Guide
Package Description
Domed, Nondiffused
Untinted
Flat Top, Nondiffused,
Untinted
Viewing Angle
2θ1/2
28°
125°
Amber
λd = 590 nm
HLMA-QL00
HLMT-QL00
HLMA-PL00
HLMT-PL00
Reddish-Orange
λd = 615 nm
HLMA-QH00
HLMT-QH00
HLMA-PH00
HLMT-PH00
Package
Outline
B
A
Package Dimensions
(A) Flat Top Lamps
0.50 (0.020) REF.
1.40 (0.055)
1.65 (0.065)
11.68 (0.460)
10.67 (0.420)
BOTH SIDES
CATHODE
1.14 (0.045)
1.40 (0.055)
ANODE
1.65 (0.065) DIA.
1.91 (0.075)
0.20 (0.008) MAX.
0.46(0.018)
0.56(0.022)
0.25 (0.010) MAX.
NOTE 2
0.76 (0.030) MAX.
0.18 (0.007)
0.23 (0.009)
1.91 (0.075)
2.16 (0.085)
0.58 (0.023)
0.43 (0.017)
1.91 (0.075)
2.41 (0.095)
2.08 (0.082)
2.34 (0.092)
CATHODE
STRIPE
(B) Domed Lamps, Diffused and Nondiffused
0.50 (0.020) REF.
11.68(0.460)
10.67(0.420)
BOTH SIDES
CATHODE
0.18 (0.007)
0.23 (0.009)
2.03 (0.080)
1.78 (0.070)
ANODE
1.65 (0.065) DIA.
1.91 (0.075)
0.20 (0.008) MAX.
0.46 (0.018)
0.56 (0.022)
0.25 (0.010) MAX.
NOTE 2
0.79 (0.031)
0.53 (0.021)
1.91(0.075)
2.16(0.085)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
0.76 (0.030) R.
0.89 (0.035)
0.94 (0.037)
1.24 (0.049)
0.63 (0.025)
0.38 (0.015)
2.92 (0.115)
MAX.
2.08(0.082)
2.34(0.092)
CATHODE
STRIPE
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Agilent(Hewlett-Packard) HLMT-PH00
Absolute Maximum Ratings at TA = 25°C
HLMA-QL00/QH00/PL00/PH00
Peak Forward Current[2] ........................................................... 200 mA
Average Forward Current (IPEAK = 200 mA)[1,2] ......................... 45 mA
DC Forward Current[3,5,6] ........................................................... 50 mA
Power Dissipation .................................................................... 105 mW
HLMT-QL00/QH00/PL00/PH00
Peak Forward Current[2] ........................................................... 100 mA
Average Forward Current (IPEAK = 100 mA)[1,2] ......................... 37 mA
DC Forward Current[3,5,6] ........................................................... 50 mA
Power Dissipation .................................................................... 120 mW
All Devices
Reverse Voltage (IR = 100 µA) ........................................................ 5 V
Transient Forward Current (10 µs Pulse)[5] .............................. 500 mA
Operating Temperature Range ....................................... -40 to +100°C
Storage Temperature Range .......................................... -55 to +100°C
LED Junction Temperature .......................................................... 110°C
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body .......................... 260°C for 5 seconds
SMT Reflow Soldering Temperatures
Convective Reflow ............. 235°C Peak, above 183°C for 90 seconds
Vapor Phase Reflow ........................................... 215°C for 3 minutes
Notes:
1. Maximum IAVG at f = 1 kHz.
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 4.
4. The transient peak current is the maximum non-recurring peak current these devices
can withstand without damaging the LED die and wire bonds. Operation at currents
above Absolute Maximum Peak Forward Current is not recommended.
5. Drive currents between 5 mA and 30 mA are recommended for best long term
performance.
6. Operation at currents below 5 mA is not recommended, please contact your Hewlett-
Packard sales representative.
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