TYPE TRANSISTOR. HM879 Datasheet

HM879 TRANSISTOR. Datasheet pdf. Equivalent

HM879 Datasheet
Recommendation HM879 Datasheet
Part HM879
Description SILICON NPN EPITAXIAL TYPE TRANSISTOR
Feature HM879; HI-SINCERITY MICROELECTRONICS CORP. HM879 SILICON NPN EPITAXIAL TYPE TRANSISTOR Description For 1.5V.
Manufacture Hi-Sincerity Mocroelectronics
Datasheet
Download HM879 Datasheet




Hi-Sincerity Mocroelectronics HM879
HI-SINCERITY
MICROELECTRONICS CORP.
HM879
SILICON NPN EPITAXIAL TYPE TRANSISTOR
Description
For 1.5V And 3V Electronic Flash Use.
Spec. No. : HM200203
Issued Date : 1996.07.01
Revised Date : 2002.02.26
Page No. : 1/3
Features
SOT-89
Charger-up time is about 1 mS faster than of a germanium transistor.
Small saturation voltage can bring less power dissipation and flashing times.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ....................................................................................... 1 W
Maximum Voltages and Currents (Ta=25°C)
BVCBO Collector to Base Voltage....................................................................................... 30 V
BVCEX Collector to Emitter Voltage .................................................................................... 20 V
BVCEO Collector to Emitter Voltage.................................................................................... 10 V
BVEBO Emitter to Base Voltage............................................................................................ 6 V
IC Collector Current............................................................................................................... 3 A
IC Collector Current (Pluse) .................................................................................................. 5 A
Electrical Characteristics (Ta=25°C)
Symbol
Min. Typ. Max.
BVCEO
10
-
-
BVEBO
6
-
-
BVCBO
30
-
-
BVCEX
20
-
-
ICBO
- - 100
IEBO
- - 100
*VCE(sat)
-
0.3 0.4
*hFE
140 210 400
fT - 200 -
Cob - 30 -
Unit
V
V
V
V
nA
nA
V
MHz
pF
Test Condition
IC=1mA
IE=10uA
IC=10uA
IC=1mA, VBE=3V
VCB=20V
VBE=4V
IC=3A, IB=60mA
VCE=2V, IC=3A
VCE=10V, IC=50mA
VCB=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HM879
HSMC Product Specification



Hi-Sincerity Mocroelectronics HM879
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HM200203
Issued Date : 1996.07.01
Revised Date : 2002.02.26
Page No. : 2/3
Current Gain & Collector Current
1000
125oC
75oC
25oC
Saturation Voltage & Collector Current
1000
VCE(sat) @ IC=50IB
100 75oC
hFE @ VCE=2V
125oC
25oC
100
1
10 100 1000
Collector Current-IC (mA)
10000
10
1
10 100 1000
Collector Current-IC (mA)
10000
Cutoff Frequency & Collector Current
1000
Capacitance & Reverse-Biased Voltage
100
VCE=10V
100
Cob
10
10
11
1 10 100 1000 1
10 100
Collector Current (mA)
Reverse Biased Voltage (V)
HM879
HSMC Product Specification



Hi-Sincerity Mocroelectronics HM879
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : HM200203
Issued Date : 1996.07.01
Revised Date : 2002.02.26
Page No. : 3/3
C
B
1
2
E
F
G
A
D
3
J
H
I
Marking:
Date Code
HM
879
Laser Marking
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
DIM
Inches
Min. Max.
A 0.1732 0.1811
B 0.1594 0.1673
C 0.0591 0.0663
D 0.0945 0.1024
E 0.0141 0.0201
Millimeters
Min. Max.
4.40 4.60
4.05 4.25
1.50 1.70
2.40 2.60
0.36 0.51
DIM
Inches
Min. Max.
F 0.0583 0.0598
G 0.1165 0.1197
H 0.0551 0.0630
I 0.0138 0.0161
J 0.0319 0.0421
*: Typical
Millimeters
Min. Max.
1.48 1.52
2.96 3.04
1.40 1.60
0.35 0.41
0.81 1.07
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM879
HSMC Product Specification







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