planar technology. HMBD2003S Datasheet

HMBD2003S technology. Datasheet pdf. Equivalent

HMBD2003S Datasheet
Recommendation HMBD2003S Datasheet
Part HMBD2003S
Description General purpose diodes fabricated in planar technology
Feature HMBD2003S; HI-SINCERITY MICROELECTRONICS CORP. HMBD2003CS Description The HMBD2003CS are general purpose diod.
Manufacture Hi-Sincerity Mocroelectronics
Datasheet
Download HMBD2003S Datasheet




Hi-Sincerity Mocroelectronics HMBD2003S
HI-SINCERITY
MICROELECTRONICS CORP.
HMBD2003\C\S
Description
The HMBD2003\C\S are general purpose diodes fabricated in planar
technology, and encapsulated in small plastic SMD SOT-23 package.
Features
Small plastic SMD package
Switching speed: max. 50 nS
General application:
Continuous reverse voltage: Max. 200 V
Repetitive peak reverse voltage: Max. 250 V
Repetitive peak forward current: Max. 625 mA
Absolute Maximum Ratings (Ta=25°C)
Characteristic
HMBD2003 Repetitive Peak Reverse Voltage
HMBD2003C Repetitive Peak Reverse Voltage
HMBD2003S Repetitive Peak Reverse Voltage
HMBD2003 Continuous reverse voltage
HMBD2003C Continuous reverse voltage
HMBD2003S Continuous reverse voltage
Forward Continuous Current at Ta=25°C
Repetitive Peak Forward Current at Ta=25°C
Surge Forward Current at t =1mS, Ta=25°C
Power Dissipation
Junction Temperature
Storage Temperature Range
Symbol
VRRM
VR
lF
IFRM
IFSM
PD
Tj
Tstg
Characteristics (Ta=25°C)
Characteristic
Forward Voltage
HMBD2003 Reverse Current
HMBD2003C Reverse Current
HMBD2003S Reverse Current
Total Capacitance
Reverse Recovery Time
BVR
Symbol
VF(1)
VF(2)
IR
CT
Trr
BVR
Condition
IF=100mA
IF=200mA
VR=200V
VR=200V
VR=200V
VR=0V, f=1MHz
IF=30mA to IR=30mA
RL=100measured at
IR=3mA
IR=100uA
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 1/2
SOT-23
Value
250
250
250
200
200
200
225
625
1
250 Max
150
-65~+150
Unit
V
V
mA
mA
A
mV
°C
°C
Min Max Unit
-
-
1
1.25
V
- 100
- 100 nA
- 100
5 - pF
50 - nS
250 -
V
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification



Hi-Sincerity Mocroelectronics HMBD2003S
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 2/2
A
L
3
BS
12
VG
C
Diagram:
3
12
HMBD2003
33
12
HMBD2003C
12
HMBD2003S
Marking:
A82
12
HMBD2003
C3C
C3S
HMBD2003C
HMBD2003S
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
D H KJ
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.1102 0.1204 2.80
3.04
B 0.0472 0.0630 1.20
1.60
C 0.0335 0.0512 0.89
1.30
D 0.0118 0.0197 0.30
0.50
G 0.0669 0.0910 1.70
2.30
H 0.0005 0.0040 0.013
0.10
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
J 0.0034 0.0070 0.085 0.177
K 0.0128 0.0266 0.32
0.67
L 0.0335 0.0453 0.85
1.15
S 0.0830 0.1083 2.10
2.75
V 0.0098 0.0256 0.25
0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification







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