CASE 318 08/ STYLE 8 SOT 23 (TO 236AB)
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by BAS21LT1/D
High Voltage Switching Diode
3 CATHODE 1 ANOD...
Description
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by BAS21LT1/D
High Voltage Switching Diode
3 CATHODE 1 ANODE
BAS21LT1
Motorola Preferred Device
MAXIMUM RATINGS
Rating Continuous Reverse Voltage Peak Forward Current Peak Forward Surge Current Symbol VR IF IFM(surge) Value 250 200 625 Unit Vdc mAdc mAdc
1 2
3
CASE 318 – 08, STYLE 8 SOT– 23 (TO – 236AB)
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR– 5 Board(1) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate,(2) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Symbol PD Max 225 1.8 RqJA PD 556 300 2.4 RqJA TJ, Tstg 417 – 55 to +150 Unit mW mW/°C °C/W mW mW/°C °C/W °C
DEVICE MARKING
BAS21LT1 = JS
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current (VR = 200 Vdc) (VR = 200 Vdc, TJ = 150°C) Reverse Breakdown Voltage (IBR = 100 µAdc) Forward Voltage (IF = 100 mAdc) (IF = 200 mAdc) Diode Capacitance (VR = 0, f = 1.0 MHz) Reverse Recovery Time (IF = IR = 30 mAdc, RL = 100 Ω) 1. FR– 5 = 1.0 0.75 2. Alumina = 0.4 0.3 IR — — V(BR) VF — — CD trr — — 1000 1250 5.0 50 pF ns 250 1.0 100 — Vdc mV µAdc
0.062 in. 0.024 in. 99.5% alumina.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
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