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BAT60J Dataheets PDF



Part Number BAT60J
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description SMALL SIGNAL SCHOTTKY DIODE
Datasheet BAT60J DatasheetBAT60J Datasheet (PDF)

® BAT60J SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS s VERY SMALL CONDUCTION LOSSES s NEGLIGIBLE SWITCHING LOSSES s LOW FORWARD VOLTAGE DROP s EXTREMELY FAST SWITCHING s SURFACE MOUNTED DEVICE A 60 K DESCRIPTION Schottky barrier diode encapsulated in a SOD-323 small SMD package. This device is intended for use in portable equipments. It is suited for DC to DC converters, step-up conversion and power management. SOD-323 ABSOLUTE RATINGS (limiting values) Symbol Parameter VRRM Repe.

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® BAT60J SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS s VERY SMALL CONDUCTION LOSSES s NEGLIGIBLE SWITCHING LOSSES s LOW FORWARD VOLTAGE DROP s EXTREMELY FAST SWITCHING s SURFACE MOUNTED DEVICE A 60 K DESCRIPTION Schottky barrier diode encapsulated in a SOD-323 small SMD package. This device is intended for use in portable equipments. It is suited for DC to DC converters, step-up conversion and power management. SOD-323 ABSOLUTE RATINGS (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF Peak forward current IFSM Surge non repetitive forward current Ptot Power Dissipation Tstg Storage temperature range Tj Maximum operating junction temperature * TL Maximum temperature for soldering during 10s δ = 0.11 tp=10ms Ta=25°C Value Unit 10 V 3 A 5 A 310 mW - 65 to +150 °C 150 °C 260 °C * : dPtot < 1 thermal runaway condition for a diode on its own heatsink dTj Rth( j − a) THERMAL RESISTANCE Symbol Parameter Rth (j-a) Junction to ambient (*) (*) Mounted on epoxy board with recommended pad layout. January 2003 - Ed: 6A Value 400 Unit °C/W 1/5 BAT60J STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests conditions Min. Typ. Max. Unit VF * Forward voltage drop Tj = 25°C IF = 10 mA 0.28 0.32 V IF = 100 mA 0.35 0.40 IF = 1 A 0.53 0.58 IR ** Reverse leakage current Tj = 25°C VR = 5 V 1 3 µA Tj = 25°C VR = 8 V 1.3 4 Tj = 25°C VR = 10 V 2 6 Tj = 25°C VR = 12 V 2.5 7.5 Tj = 80°C VR = 8 V 73 150 Pulse test: * tp = 380µs, δ < 2% ** tp = 5ms, δ < 2% To evaluate the conduction losses the following equation: P = 0.38 x IF(AV) + 0.17 IF2(RMS) 2/5 Fig. 1: Average forward power dissipation versus average forward current. BAT60J Fig. 2-1: Peak forward current versus ambient temperature (δ = 0.11). PF(av)(W) 0.35 0.30 δ = 0.1 δ = 0.2 δ = 0.05 δ = 0.5 IF(A) 3.2 2.8 0.25 δ=1 2.4 2.0 0.20 1.6 0.15 1.2 0.10 T 0.8 T 0.05 IF(av) (A) δ=tp/T tp 0.4 δ=tp/T tp Tamb(°C) 0.00 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 25 50 75 100 125 150 Fig. 2-2: Average forward current versus ambient temperature (δ = 0.5). Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IF(av)(A) 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 T 0.10 0.05 δ=tp/T tp Tamb(°C) 0.00 0 25 50 75 100 125 150 IM(A) 3.0 2.5 2.0 1.5 1.0 IM 0.5 t δ=0.5 0.0 1E-3 Ta=25°C Ta=50°C Ta=75°C t(s) 1E-2 1E-1 1E+0 Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout). Fig. 5: Reverse leackage current versus reverse voltage applied (typical values). Zth(j-a)/Rth(j-a) 1E+0 δ = 0.5 δ = 0.2 δ = 0.1 1E-1 Single pulse 1E-2 1E-3 1E-4 1E-3 1E-2 t(s) 1E-1 T 1E+0 δ=tp/T 1E+1 tp 1E+2 IR(mA) 1E+1 1E+0 Tj=150°C 1E-1 Tj=80°C 1E-2 1E-3 Tj=25°C VR(V) 1E-4 0 1 2 3 4 5 6 7 8 9 10 3/5 BAT60J Fig. 6: Reverse leackage current versus junction temperature (typical values). Fig. 7: Junction capacitance versus reverse voltage applied (typical values). IR[Tj] / IR[Tj=25°C] 1E+5 1E+4 VR=8V C(pF) 100 1E+3 1E+2 1E+1 1E+0 1E-1 0 Tj(°C) 10 25 50 75 100 125 150 1 F=1MHz Tj=25°C VR(V) 10 Fig. 8-1: Forward voltage drop versus forward current (High level). Fig. 8-2: Forward voltage drop versus forward current (Low level). IFM(A) 1E+1 1E+0 Tj=150°C (Typical values) Tj=25°C (Maximum values) Tj=80°C (Typical values) VFM(V) 1E-1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 IFM(A) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.1 Tj=150°C (Typical values) Tj=80°C (Typical values) VFM(V) 0.2 0.3 0.4 0.5 Tj=25°C (Maximum values) 0.6 0.7 0.8 Fig. 9: Thermal resistance junction to ambient versus copper surface (epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a) (°C/W) 600 550 IF=0.75A 500 450 400 350 300 250 200 150 S(Cu) (mm²) 100 0 10 20 30 40 50 60 70 80 90 100 4/5 PACKAGE MECHANICAL DATA SOD-323 BAT60J H b E D c Q1 L DIMENSIONS A1 REF. Millimeters Inches Min. Max. Min. Max. A 1.17 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 A c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 MARKING Type Marking BAT60JFILM 60 s Epoxy meets UL94V-0 Package SOD-323 Weight 0.005 g. Base qty 3000 Delivery mode Tape & reel Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without n.


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