Document
®
BAT60J
SMALL SIGNAL SCHOTTKY DIODE
FEATURES AND BENEFITS
s VERY SMALL CONDUCTION LOSSES s NEGLIGIBLE SWITCHING LOSSES s LOW FORWARD VOLTAGE DROP s EXTREMELY FAST SWITCHING s SURFACE MOUNTED DEVICE
A 60 K
DESCRIPTION
Schottky barrier diode encapsulated in a SOD-323 small SMD package.
This device is intended for use in portable equipments. It is suited for DC to DC converters, step-up conversion and power management.
SOD-323
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF
Peak forward current
IFSM Surge non repetitive forward current
Ptot Power Dissipation
Tstg Storage temperature range
Tj Maximum operating junction temperature *
TL Maximum temperature for soldering during 10s
δ = 0.11 tp=10ms Ta=25°C
Value
Unit
10
V
3
A
5
A
310
mW
- 65 to +150
°C
150
°C
260
°C
* : dPtot <
1
thermal runaway condition for a diode on its own heatsink
dTj
Rth( j − a)
THERMAL RESISTANCE
Symbol
Parameter
Rth (j-a) Junction to ambient (*)
(*) Mounted on epoxy board with recommended pad layout.
January 2003 - Ed: 6A
Value 400
Unit °C/W
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BAT60J
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
Tests conditions
Min. Typ. Max. Unit
VF * Forward voltage drop
Tj = 25°C
IF = 10 mA
0.28 0.32
V
IF = 100 mA
0.35 0.40
IF = 1 A
0.53 0.58
IR ** Reverse leakage current Tj = 25°C
VR = 5 V
1
3
µA
Tj = 25°C
VR = 8 V
1.3 4
Tj = 25°C
VR = 10 V
2
6
Tj = 25°C
VR = 12 V
2.5 7.5
Tj = 80°C
VR = 8 V
73 150
Pulse test: * tp = 380µs, δ < 2% ** tp = 5ms, δ < 2%
To evaluate the conduction losses the following equation: P = 0.38 x IF(AV) + 0.17 IF2(RMS)
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Fig. 1: Average forward power dissipation versus average forward current.
BAT60J
Fig. 2-1: Peak forward current versus ambient temperature (δ = 0.11).
PF(av)(W)
0.35
0.30
δ = 0.1 δ = 0.2 δ = 0.05
δ = 0.5
IF(A)
3.2
2.8
0.25
δ=1
2.4
2.0 0.20
1.6 0.15
1.2
0.10
T
0.8
T
0.05
IF(av) (A)
δ=tp/T
tp
0.4
δ=tp/T
tp
Tamb(°C)
0.00
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
25
50
75
100
125
150
Fig. 2-2: Average forward current versus ambient temperature (δ = 0.5).
Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values).
IF(av)(A)
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
T
0.10
0.05 δ=tp/T
tp
Tamb(°C)
0.00
0
25
50
75
100
125
150
IM(A) 3.0
2.5
2.0
1.5
1.0
IM
0.5
t δ=0.5
0.0 1E-3
Ta=25°C
Ta=50°C
Ta=75°C
t(s)
1E-2
1E-1
1E+0
Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout).
Fig. 5: Reverse leackage current versus reverse voltage applied (typical values).
Zth(j-a)/Rth(j-a) 1E+0
δ = 0.5
δ = 0.2
δ = 0.1
1E-1
Single pulse
1E-2
1E-3 1E-4
1E-3
1E-2
t(s) 1E-1
T
1E+0
δ=tp/T 1E+1
tp 1E+2
IR(mA) 1E+1
1E+0
Tj=150°C
1E-1
Tj=80°C
1E-2
1E-3
Tj=25°C
VR(V) 1E-4
0 1 2 3 4 5 6 7 8 9 10
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BAT60J
Fig. 6: Reverse leackage current versus junction temperature (typical values).
Fig. 7: Junction capacitance versus reverse voltage applied (typical values).
IR[Tj] / IR[Tj=25°C] 1E+5
1E+4
VR=8V
C(pF) 100
1E+3
1E+2
1E+1
1E+0 1E-1
0
Tj(°C)
10
25
50
75
100
125
150
1
F=1MHz Tj=25°C
VR(V) 10
Fig. 8-1: Forward voltage drop versus forward current (High level).
Fig. 8-2: Forward voltage drop versus forward current (Low level).
IFM(A) 1E+1
1E+0
Tj=150°C (Typical values)
Tj=25°C (Maximum values)
Tj=80°C (Typical values)
VFM(V) 1E-1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
IFM(A) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
0.0 0.1
Tj=150°C (Typical values) Tj=80°C (Typical values)
VFM(V) 0.2 0.3 0.4 0.5
Tj=25°C (Maximum values)
0.6 0.7 0.8
Fig. 9: Thermal resistance junction to ambient versus copper surface (epoxy printed circuit board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
600
550
IF=0.75A
500
450
400
350
300
250
200
150
S(Cu) (mm²)
100 0
10 20 30 40 50 60 70 80 90 100
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PACKAGE MECHANICAL DATA SOD-323
BAT60J
H b
E
D
c
Q1
L
DIMENSIONS
A1
REF.
Millimeters
Inches
Min. Max. Min. Max.
A
1.17
0.046
A1
0
0.1
0
0.004
b
0.25 0.44 0.01 0.017
A
c
0.1
0.25 0.004 0.01
D
1.52
1.8
0.06 0.071
E
1.11 1.45 0.044 0.057
H
2.3
2.7
0.09 0.106
L
0.1
0.46 0.004 0.02
Q1
0.1
0.41 0.004 0.016
MARKING
Type
Marking
BAT60JFILM
60
s Epoxy meets UL94V-0
Package SOD-323
Weight 0.005 g.
Base qty 3000
Delivery mode Tape & reel
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without n.