AN4506

Heatsinks HEATSINKS Power Assemblies DS5404-1.0 November 2000 The current range of heatsinks is illustrated with a brief resumé of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules. All heatsinks are suitable for Natural Air Cooling (AN) and Forced Air Cooling (FC). In addition to a vast experience of AN and FC cooling methods we also have many years experience in liquid and phase change cooling. A range of coolers for 17mm to 100mm silicon diameter devices is available, as is a range of associated clamps. AIR COOLED HEATSINKS All dimensions shown in mm unless stated otherwise. 0.5 0.48 THERMAL RESISTANCE (˚C/W) 0.15 THERMAL RESISTANCE (˚C/W) 0.46 0.44 0.42 0.4 0.38 0.36 0.34 0.32 0.3 125 175 225 275 325 375 HEATSINK LENGTH (mm) 200W 0.145 0.14 0.135 0.13 77.5 M8 slots 0.125 200W 0.12 125 165 205 245 285 HEATSINK LENGTH (mm) 27 175 Cross sectional area (cm2): 52.3 Weight kg/m: 141.2 Air natural 0.44 THERMAL RESISTANCE (˚C/W) THERMAL RESISTANCE (˚C/W) Forced air (5m/s) 0.1 Heatsink profile: ED M6 slot 222 ± 1 0.42 0.4 0.38 0.36 0.34 0.32 200 W 0.3 125 175 225 275 325 375 HEATSINK LENGTH (mm) 0.095 0.085 0.08 200W 50 0.075 125 175 225 275 325 375 HEATSINK LENGTH (mm) Cross sectional area (cm2): 124.08 Weight kg/m: 31 Air natural Forced air (5m/s) Heatsink profile: EM M8 slots 0.09 120 1/5 www.dynexsemi.com Heatsinks THERMAL RE...