CZRM27C39P

Surface Mount Zener Diode COMCHIP www.comchiptech.com CZRM27C3V6P THRU C200P Features ‘ Low profile surface-mount package ‘ Zener and surge current specification ‘ Low leakage current ‘ Excellent stability Power Dissipation 0.8Watts MINI-SMA 0.161(4.1) 0.146(3.7) 0.012(0.3)Typ. 0.071(1.8) 0.055(1.4) Mechanical Data ‘ Case: Molded plastic MINI-SMA ‘ ‘ ‘ ‘ ‘ Epoxy: UL 94V-0 rate flame retardant Solderable per MIL-STD-202, method 208 guaranteed Polarity: cathode band Mounting position: Any Weight: 0.04gram(approx.) 0.035(0.9)Typ. 0.110(2.8) 0.094(2.4) 0.063(1.6) 0.055(1.4) 0.035(0.9)Typ. Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25oC ambient temperature unless otherwise specified. Parameter VALUE Units Forward voltage IF=0.2A 1.2 V Power Dissipation TA=25 C ( Note ) o TL=80 C o 0.8 2.3 W Non-repetitive peak pulse TJ=25 C power dissipation 100us square pulse Non-repetitive peak pulse TJ=25 C power dissipation 10/1000us waveform (CZRM27C7V5P to C100P) Non-repetitive peak pulse TJ=25 C power dissipation 10/1000us waveform (CZRM27C110P to C200P) o o o 300 W 150 W 100 W Thermal resistance junction to lead ambient ( Note ) Operating junction and Storage Temperature Range NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick) 30 180 KW 150 / -55 to +150 o C MDS0310010B Page 1 Surface Mount Zener Diode COMCHIP www.comchiptech.com CZRM27C6V8P THRU CZRM27C200P Application Case Part No...