(Datasheet) D10 data sheet PDF





D10 Datasheet, Memory Micromodules General Information for D1/ D2 and C Packaging

D10   D10  

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D10, D15, D20, D22, C20, C30 MICROMODULE S Memory Micromodules General Informati on for D1, D2 and C Packaging s Microm odules were developed specifically for embedding in Smartcards and Memory Card s The Micromodule provides: – Support for the chip – Electrical contacts Suitable embedding interface for glu ing the module to the plastic package potting side contact side s D15

D10 Datasheet, Memory Micromodules General Information for D1/ D2 and C Packaging

D10   D10  
s Physical dimensions and contact pos itions compliant to the ISO 7816 standa rd Micromodules delivered as a continuo us Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 s 1 1 1 1 DES CRIPTION Memory Cards consist of two ma in parts: the plastic card, and the emb edded Micromodule (which, in








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