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D10 Dataheets PDF



Part Number D10
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description Memory Micromodules
Datasheet D10 DatasheetD10 Datasheet (PDF)

D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous.

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D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 s 1 1 1 1 DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Modul e D10 D15 D20 D22 C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355 ST14C02, ST1305B, ST1335, ST1336, ST1355 ST14C02, M14C04, M14C16, M14C32 M14C64, M14128, M14256 M35101, M35102 M35101, M35102 December 1999 1/13 MICROMODULES Table 2. Memory Card Products Type ST14C02C M14C04 M14C16 M14C32 M14C64 M14128 M14256 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336 M35101 M35102 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM Contactless Memory Chip with 64-bit Unique ID, 13.56 MHz, 2048 bit EEPROM Memory Card IC, 272 bit High Endurance EEPROM with Advanced Security Mechanisms Description (please see the individual product data sheets for full specifications) Memory Card IC, 2 Kbit (256 x 8) Serial I2C Bus EEPROM Memory Card IC, 4 Kbit Serial I2C Bus EEPROM Memory Card IC, 16 Kbit Serial I2C Bus EEPROM Memory Card IC, 32 Kbit Serial I2C Bus EEPROM Memory Card IC, 64 Kbit Serial I2C Bus EEPROM Memory Card IC, 128 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 bit OTP EPROM with Lock-Out Memory Card IC, 192 bit High Endurance EEPROM with Secure Logic Access Control Process 1.2 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 3.5 µm 1.5 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm 0.6 µm 0.6 µm Technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS NMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Module Style D15, D20 D20 D20 D20 D22 D22 D22 D10 D10, D15 D10 D10 D10, D15 D10, D15 C20, C30 C20, C30 The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending.


CZTUX87 D10 D1001UK


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