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2SK2221 Dataheets PDF



Part Number 2SK2221
Manufacturers Hitachi Semiconductor
Logo Hitachi Semiconductor
Description Silicon N-Channel MOSFET
Datasheet 2SK2221 Datasheet2SK2221 Datasheet (PDF)

2SK2220, 2SK2221 Silicon N-Channel MOS FET Application Low frequency power amplifier Complementary pair with 2SJ351, 2SJ352 Features • • • • • • • High power gain Excellent frequency response High speed switching Wide area of safe operation Enhancement-mode Good complementary characteristics Equipped with gate protection diodes Outline TO-3P D G 1 2 3 1. Gate 2. Source (Flange) 3. Drain S 2SK2220, 2SK2221 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage 2SK2220 2SK2221 Ga.

  2SK2221   2SK2221


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2SK2220, 2SK2221 Silicon N-Channel MOS FET Application Low frequency power amplifier Complementary pair with 2SJ351, 2SJ352 Features • • • • • • • High power gain Excellent frequency response High speed switching Wide area of safe operation Enhancement-mode Good complementary characteristics Equipped with gate protection diodes Outline TO-3P D G 1 2 3 1. Gate 2. Source (Flange) 3. Drain S 2SK2220, 2SK2221 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage 2SK2220 2SK2221 Gate to source voltage Drain current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Note 1. Value at Tc = 25 °C VGSS ID I DR Pch* Tch Tstg 1 Symbol VDSX Ratings 180 200 ±20 8 8 100 150 –55 to +150 Unit V V A A W °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage 2SK2220 2SK2221 V(BR)GSS VGS(off) VDS(sat) |yfs| Ciss Coss Crss t on t off Symbol V(BR)DSX Min 180 200 ±20 0.15 — 0.7 — — — — — Typ — — — — — 1.0 600 800 8 250 90 Max — — — 1.45 12 1.4 — — — — — V V V S pF pF pF ns ns I G = ±100 µA, VDS = 0 I D = 100 mA VDS = 10 V I D = 8 A, VGD = 0 V*1 ID = 3 A VDS = 10 V*1 VGS = –5 V VDS = 10 V f = 1 MHz VDD = 30 V ID = 4 A Unit V Test conditions I D = 10 mA, VGS = –10 V Gate to source breakdown voltage Gate to source cutoff voltage Drain to source saturation voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time Note 1. Pulse Test 2 2SK2220, 2SK2221 Power vs. Temperature Derating 150 Pch (W) 20 Ta = 25°C 10 Drain Current ID (A) PW = Maximum Safe Operation Area 100 PW 10 5 C D m = Channel Dissipation s 10 O pe ra tio (1 o Sh (1 0 s m 2 1.0 0.5 t) n = (T C o Sh t) 50 2SK2220 25 ) °C 2SK2221 0 50 100 Tc (°C) 150 0.2 5 10 20 50 100 200 500 Drain to Source Voltage VDS (V) Case Temperature Typical Output Characteristics 10 VGS = 10 V 9 8 7 Drain Current ID (A) 6 6 5 4 4 3 2 2 0 0 1 50 0 Pch = 125 W TC = 25°C 10 Typical Output Characteristics TC = 25°C 9 7 6 6 5 4 4 3 2 1 2 6 8 4 Drain to Source Voltage VDS (V) 0 10 VGS = 10 V 8 8 Drain Current ID (A) 8 2 10 30 40 20 Drain to Source Voltage VDS (V) 3 2SK2220, 2SK2221 Typical Transfer Characteristics 10 1.0 Typical Transfer Characteristics =– Drain Current ID (A) 25 Drain Current ID (A) 25 =– 0.4 0.2 °C 0.8 0.4 1.2 1.6 Gate to Source Voltage VGS (V) 8 25° VDS = 10 V C 0.8 75 VDS = 10 V TC 4 2 0 4 2 6 8 Gate to Source Voltage VGS (V) 10 T C 6 0.6 75 25 0 2.0 Forward Transfer Admittance vs. Frequency Forward Transfer Admittance yfs (S) 5 1.0 Switching Time t on, t off (ns) 500 Switching Time vs. Drain Current t on 200 100 50 0.1 TC = 25°C VDS = 10 V ID = 2 A t off 0.01 20 10 5 0.1 0.001 0.0005 2k 10 k 1M 100 k Frequency f (Hz) 10 M 20 M 0.2 2 0.5 1.0 Drain Current ID (A) 5 10 4 2SK2220, 2SK2221 Switching Time Test Circuit Output RL Input Input 10% t on PW = 50 µs duty ratio = 1% 30 V 50 Ω Output 90% t off 10% Waveforms 90% 5 Unit: mm 5.0 ± 0.3 15.6 ± 0.3 1.0 φ3.2 ± 0.2 4.8 ± 0.2 1.5 0.5 14.9 ± 0.2 19.9 ± 0.2 1.6 1.4 Max 2.0 2.8 18.0 ± 0.5 1.0 ± 0.2 2.0 0.6 ± 0.2 3.6 0.9 1.0 5.45 ± 0.5 5.45 ± 0.5 Hitachi Code JEDEC EIAJ Weight (reference value) TO-3P — Conforms 5.0 g 0.3 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire o.


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