33661

Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Document order number: MC33661 Rev 3.0, 10/2004 Advance Information LIN Enhanced Physical Interface Local Interconnect Network (LIN) is a serial communication protocol designed to support automotive networks in conjunction with Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. The 33661 is a Physical Layer component dedicated to automotive LIN subbus applications. It offers slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and programming modes, excellent radiated emission performance, and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode. Features Operational from VSUP 6.0 V to 18 V DC, Functional up to 27 V DC, and Handles 40 V During Load Dump Active Bus Waveshaping Offering Excellent Radiated Emission Performance 5.0 kV ESD on LIN Bus Terminal 30 kΩ Internal Pullup Resistor LIN Bus Short-to-Ground or High Leakage in Sleep Mode -18 V to +40 V DC Voltage at LIN Terminal 8.0 µA Standby Current in Sleep Mode Local and Remote Wake-Up Capability Reported by INH and RXD Terminals 5.0 V and 3.3 V Compatible Digital Inputs Without Any External Components Required 33661 LIN INTERFACE Freescale Semiconductor, Inc... D SUFFIX CASE 751-06 8-TERMINAL SOI...