Document
Features
• Epitaxial Planar Die Construction • Complementary PNP Type Available (IMT4) • Small Surface Mount Package • Lead Free/RoHS Compliant (Note 3) • "Green" Device, Note 4 and 5
Mechanical Data
• Case: SOT-26 • Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminal Connections: See Diagram • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Copper leadframe). • Marking Information: KX8, See Page 3 • Ordering & Date Code Information: See Page 3 • Weight: 0.016 grams (approximate)
IMX8
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
B2 B1 E1
BC
C2 E2 C1
H K
J DF B2 B1 E1
L
C2 E2 C1
SOT-26 Dim Min Max Typ
A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 F ⎯ ⎯ 0.55 H 2.90 3.10 3.00
M
J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 α 0° 8° ⎯ All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range
Symbol VCBO VCEO VEBO IC Pd RθJA
Tj, TSTG
Value 120 120 5.0 50 300 417
-55 to +150
Unit V V V mA
mW °C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic OFF CHARACTERISTICS (Note 2) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS (Note 2) DC Current Gain Collector-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Symbol Min Typ Max Unit
Test Condition
V(BR)CBO 120
⎯
⎯
V IC = 50μA
V(BR)CEO 120
⎯
⎯
V IC = 1.0mA
V(BR)EBO 5.0
⎯
⎯
V IE = 50μA
ICBO
⎯
⎯ 0.5 μA VCB = 100V
IEBO
⎯
⎯ 0.5 μA VEB = 4.0V
hFE 180 ⎯ 820 ⎯ IC = 2.0mA, VCE = 6.0V
VCE(SAT)
⎯
⎯ 0.5
V IC = 10mA, IB = 1.0mA
fT
⎯
140
⎯
MHz VCE = 12V, IC = 2.0mA, f = 100MHz
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.
2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30304 Rev. 8 - 2
1 of 3 www.diodes.com
IMX8
© Diodes Incorporated
PD, POWER DISSIPATION (mW)
350 300 250
200 150
100
50
0 0
100
25 50 75 100 125 150 175
TA, AMBIENT TEMPERATURE (°C) Fig. 1, Max Power Dissipation vs. Ambient Temperature
200
TA = 25°C
hFE, DC CURRENT GAIN
600
500
TA = 75°C
400 300 200
TA = 25°C TA = -25°C
100
0 1.0 10.0 100
IC, COLLECTOR CURRENT (mA) Fig. 2 Typical DC Current Gain vs. Collector Current
1.0
VCE(SAT), COLLECTOR TO EMITTER SATURATION VOLTAGE (V)
IC, COLLECTOR CURRENT (mA)
10.0 1.0
TA = 75°C TA = -25°C
0.100
TA = 150°C TA = 25°C
TA = -50°C
fT, GAIN BANDWIDTH PRODUCT (MHz)
0.1 0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VBE(ON), BASE-EMITTER VOLTAGE (V) Fig. 3 Typical Collector Current vs. Base-Emitter Voltage
0.9
1,000
VCE = 5 Volts
100
10
IC, COLLECTOR CURRENT (mA)
0.010 1
6 5 4
10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 4 Typical Collector-Emitter Voltage
vs. Collector Current
IB = 16µA
IB = 14µA IB = 12µA
IB = 10µA
3
IB = 8µA
2
IB = 6µA
1 IB = 4µA
1 1 10 100
IC, COLLECTOR CURRENT (mA)
Fig. 5 Typical Gain Bandwidth Product
vs. Collector Current
0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VCE, COLLECTOR-EMITTER VOLTAGE (V) Fig. 6 Typical Collector Current vs. Collector-Emitter Voltage
DS30304 Rev. 8 - 2
2 of 3 www.diodes.com
IMX8
© Diodes Incorporated
Ordering Information (Note 5 & 6 )
Notes:
Device IMX8-7-F
Packaging SOT-26
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Shipping 3000/Tape & Reel
KX8
YM
KX8 = Product Type Marking Code YM = Date Code Marking Y =Year ex: T = 2006 M = Month ex: 9 = September
Date Code Key Year Code
Month Code
2002 N
Jan 1
2003 P
Feb 2
2004 R
2005 S
2006 T
2007 U
2008 V
2009 W
2010 X
Mar Apr May Jun Jul Aug Sep Oct 3 4 5 6 78 9O
2011 Y
Nov N
2012 Z
Dec D
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described.