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Part Number 236
Manufacturers Wakefield Thermal Solutions
Logo Wakefield Thermal Solutions
Description Board Level Power Semiconductor Heat Sinks
Datasheet 236 Datasheet236 Datasheet (PDF)

BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Surface Mount Heat Sinks Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250 D 2PAK, TO-220, SOL-20 Thermal Performance at Typical Load Natural Convection Forced Convection 55°C .

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BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Surface Mount Heat Sinks Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250 D 2PAK, TO-220, SOL-20 Thermal Performance at Typical Load Natural Convection Forced Convection 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM PATENT 361317 Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk, tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated. 216-40CTR A RECOMMENDED COPPER FOOTPRINT USE MAX COPPER TO ALLOW MAX CONDUCTION TO HEAT SINK .660 (16.8) .640 (16.3) .660 (16.8) .640 (16.3) COPPER FOOTPRINT FOR HEAT SINK MIN COPPER FOR HEAT SINK 1.260 (32.0) .390 (9.9) REF: JEDEC TO-263 D2PAK JEDEC TO-220AB JEDEC TO-261AA JEDEC MO-184 JEDEC MS-013 JEDEC MS-025 MECHANICAL DIMENSIONS .740 (18.8) 6 LAYER BOARD, D2PAK 125°C LEAD, 40°C AMBIENT AIR VELOCITY (LFM) POWER DISSIPATION, W 7 6 5 4 3 2 1 AIR PERPENDICULAR TO FINS AIR PARALLEL TO FINS NO HEAT SINK 0 100 200 300 400 500 216-40CT TAPE DETAILS .600 (15.2) .626 (15.9) A .060 (1.5) SECTION A-A .640 (16.3) .215 (5.5) .600 (15.2) .020 (0.5) .600 (15.2) .390 (9.9) .215 (5.5) .020 (0.5) .768 (19.5) .945 (24.0) REEL DETAILS 13.000 (330.2) .409 (10.4) .215 (5.5) 216-40CTT NOTES: 1. ESD MATERIAL WITH PLUGS 2. LENGTH OF TUBE: 16.25 INCHES 3. QUANTITY PER TUBE: 25 PIECES TUBE DETAILS .390 (9.9) .640 (16.3) .265 (6.7) 1.28 (32.5) .470 (11.9) NOTES: 1. ESD MATERIAL 2. EIA STANDARD, EIA-481-3 3. LENGTH OF REEL: APPROXIMATELY 6 METERS 4. QUANTITY PER REEL: 250 PIECES NATURAL CONVECTION 6 LAYER BOARD, D2PAK 125°C LEAD, 40°C AMBIENT POWER, W TEMPERATURE RISE, °C 100 80 60 40 20 0 HS, 2 IN. BOARD HS, 4 IN. BOARD THERMAL PERFORMANCE DATA 6 LAYER BOARD, D2PAK AIR VELOCITY (LFM) 0 100 200 300 400 500 THERMAL RESISTANCE, C/W 30 25 20 15 10 0 .840 (21.3) .350 (8.9) .025 (0.6) NO HS, 2 IN. BOARD NO HS, 4 IN. BOARD AIR PERPENDICULAR TO FINS AIR PARALLEL TO FINS Dimensions: in. (mm) 230 and 234 SERIES Standard P/N 230-75AB 230-75AB-01 230-75AB-05 230-75AB-10 234-75AB 234-75AB-01 234-75AB-05 Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks Footprint Dimensions .570 in. (14.5) x .500 in. (12.7) .570 in. (14.5) x .500 in. (12.7) .750 in. (19.1) x .570 in. (14.5) .570 in. (14.5) x .500 in. (12.7) .570 in. (14.5) x .500 in. (12.7) .570 in. (14.5) x .500 in. (12.7) .790 in. (20.0) x .570 in. (14.5) Mounting Solderable Configuration Tab Option Vert./Horiz. No Tab Vertical 01 Horizontal 05 Vertical 10 Vert./Horiz. No Tab Vertical 01 Horizontal 05 TO-220 PATENT PENDING Height Above PC Board .750 in. (19.1) .750 in. (19.1) .500 in. (12.7) .875 in. (22.2) .790 in. (20.0) .790 in. (20.0) .500 in. (12.7) Mounting Thermal Performance at Typical Load Style Natural Convection Forced Convection Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10 to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized. MECHANICAL DIMENSIONS .500 (12.7) .570 MAX (14.5) .125 (3.2) .500 (12.7) .750 (19.1) .050 (1.3) 230-75AB .500 (12.7) .570 MAX (14.5) .500 (12.7) .250 (6.4) .063 (1.6) 234-75AB-01 .090 (2.3) .210 (5.3) 230-75AB-01 230-75AB-10 230 AND 234 SERIES .570 MAX (14.5) 230 and 234 SERIES .375 (9.5) .020 TAB 10 (0.5) .032 TAB 01 (0.8) .050 (1.3) .500 MIN (12.7) 230-75AB-05 .750 (19.1) 230 SERIES SUGGESTED TAB HOLE= ø.075 (1.9) (P.


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