S6B0107 Datasheet: 64 CH SEGMENT DRIVER FOR DOT MATRIX LCD





S6B0107 64 CH SEGMENT DRIVER FOR DOT MATRIX LCD Datasheet

Part Number S6B0107
Description 64 CH SEGMENT DRIVER FOR DOT MATRIX LCD
Manufacture Samsung semiconductor
Total Page 27 Pages
PDF Download Download S6B0107 Datasheet PDF

Features: S6B0107 64CH COMMON DRIVER FOR DOT MATRI X LCD July 2001 Ver. 0.0 Contents in th is document are subject to change witho ut notice. No part of this document may be reproduced or transmitted in any fo rm or by any means, electronic or mecha nical, for any purpose, without the exp ress written permission of LCD Driver I C Team. Precautions for Light Light has characteristics to move electrons in t he integrated circuitry of semiconducto rs, therefore may change the characteri stics of semiconductor devices when irr adiated with light. Consequently, the u sers of the packages which may expose c hips to external light such as COB, COG , TCP and COF must consider effective m ethods to block out light from reaching the IC on all parts of the surface are a, the top, bottom and the sides of the chip. Follow the precautions below whe n using the products. 1. Consider and v erify the protection of penetrating lig ht to the IC at substrate (board or gla ss) or product design stage. 2. Always test and inspect product.

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S6B0107
64CH COMMON DRIVER FOR DOT MATRIX LCD
July 2001
Ver. 0.0
Contents in this document are subject to change without notice. No part of this document may be reproduced or
transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written
permission of LCD Driver IC Team.
Precautions for Light
Light has characteristics to move electrons in the integrated circuitry of semiconductors, therefore may change
the characteristics of semiconductor devices when irradiated with light. Consequently, the users of the packages
which may expose chips to external light such as COB, COG, TCP and COF must consider effective methods to
block out light from reaching the IC on all parts of the surface area, the top, bottom and the sides of the chip.
Follow the precautions below when using the products.
1. Consider and verify the protection of penetrating light to the IC at substrate (board or glass) or product design
stage.
2. Always test and inspect products under the environment with no penetration of light.

                    
                    






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