72-pin DIMM
DIMM 72 pin
IC-554 Series
IC-554- 1- **
Socket Series Design No.
N: Without Mounting Flange MF: With Mounting Flange
I...
Description
DIMM 72 pin
IC-554 Series
IC-554- 1- **
Socket Series Design No.
N: Without Mounting Flange MF: With Mounting Flange
Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature:
Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute 30m½ max. at 10mA/20mV (Initial) -55ûC ~ +170ûC Material PEI (Glass Filled) Beryllium Copper Gold over Nickel
Insulator: Contact: Plating:
98.00 ±0.4 89.00 ±0.2 80.00 ±0.4 0.635 ±0.1 1.27x35=44.45 ±0.2 1.27x17=21.59 REF 1.27x18=22.86 REF. 1.27 ±0.1
C
IC-554-1
2-DIA3.20 Thru Hole
17.00
17.78 6.35
59.69
0.67 +0.1 0 1.27 ±0.1 1.27x35=44.45 –0.2
25.35
Front
54.00 +0.2 0
7.62
1.02 ±0.03 1.27 ±0.03 44.45 ±0.05
1.00 +0.09 -0.07
Back
(2.00)
51.66 1.27x35=44.45 ±0.05 (1.27x17=21.59) 2.00
(Position of IC)
(1.27x18=22.86) 2-1.80 ±0.05
17.78 1.80
Back
Detail C (Back) IC Device Dimensions (Reference Dra wing)
IC Device Dimensions (Reference Drawing)
98.00 REF . 89.00 ±0.1 1.27x35=44.45 ±0.1 (1.27x17=21.59) (1.27x18=22.86) 1.27 ±0.05 0.635 ±0.05
M
AX
30
8.04 ±0.05 4.84 ±0.05
.00 ∞
2-DIA.3.20
+0.1 0
Thru Hole
1.27 ±0.05 1.27x35=44.45 ±0.1 P.C.BOARD HOLE PATTERN Pattern Shown Looking Down Through Top of Socket.
72-DIA0.80
+0.1 0
Thru Hole
(Position of IC)
For Positioning Pin
2.30 ±0.1
SEC. D-D
35
...
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