pin. IC-554 Datasheet

IC-554 Datasheet PDF


Part

IC-554

Description

DIMM 72 pin

Manufacture

Yamaichi Electronics

Page 1 Pages
Datasheet
Download IC-554 Datasheet


IC-554 Datasheet
DIMM 72 pin
IC-554 Series
IC-554- 1- **
Socket Series
Design No.
N: Without Mounting Flange
MF: With Mounting Flange
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Operating Temperature:
Insulator:
Contact:
Plating:
Characteristics
1,000M½minimum at 500 VDC
700 VAC for 1 minute
30m½ max. at 10mA/20mV (Initial)
-55ûC ~ +170ûC
Material
PEI (Glass Filled)
Beryllium Copper
Gold over Nickel
98.00 ±0.4
89.00 ±0.2
80.00 ±0.4
0.635 ±0.1
1.27x35=44.45 ±0.2
1.27x17=21.59 REF 1.27x18=22.86 REF.
1.27 ±0.1
C
2-DIA3.20 Thru Hole
1.27 ±0.1
0.67
+0.1
0
1.27x35=44.45 –0.2
54.00
+0.2
0
Back
(Position of IC)
Detail C (Back)
IC Device Dimensions (Reference Drawing)
89.00 ±0.1
1.27x35=44.45 ±0.1
(1.27x17=21.59) (1.27x18=22.86)
1.27 ±0.05
0.635 ±0.05
59.69
Front
1.02 ±0.03
1.27 ±0.03
7.62 44.45 ±0.05
1.00 +0.09
-0.07
(1.27x17=21.59)
2.00
51.66
1.27x35=44.45 ±0.05
(1.27x18=22.86)
2-1.80 ±0.05
Back
IC Device Dimensions (Reference Drawing)
98.00 REF.
MAX 30.00
2-DIA.3.20
+0.1
0
Thru
Hole
For Positioning Pin
1.27 ±0.05
1.27x35=44.45 ±0.1
P.C.BOARD HOLE PATTERN
Pattern Shown Looking Down
Through Top of Socket.
72-DIA0.80
+0.1
0
Thru
Hole
(Position of IC)
SEC. D-D
35


Features Datasheet pdf DIMM 72 pin IC-554 Series IC-554- 1- ** Socket Series Design No. N: Without Mo unting Flange MF: With Mounting Flange Insulation Resistance: Withstanding Vo ltage: Contact Resistance: Operating Te mperature: Characteristics 1,000M½min imum at 500 VDC 700 VAC for 1 minute 30 m½ max. at 10mA/20mV (Initial) -55ûC ~ +170ûC Material PEI (Glass Filled) B eryllium Copper Gold over Nickel Insul ator: Contact: Plating: 98.00 ±0.4 89 .00 ±0.2 80.00 ±0.4 0.635 ±0.1 1.27x 35=44.45 ±0.2 1.27x17=21.59 REF 1.27x1 8=22.86 REF. 1.27 ±0.1 C IC-554-1 2- DIA3.20 Thru Hole 17.00 17.78 6.35 5 9.69 0.67 +0.1 0 1.27 ±0.1 1.27x35=44 .45 –0.2 25.35 Front 54.00 +0.2 0 7.62 1.02 ±0.03 1.27 ±0.03 44.45 ± 0.05 1.00 +0.09 -0.07 Back (2.00) 5 1.66 1.27x35=44.45 ±0.05 (1.27x17=21.5 9) 2.00 (Position of IC) (1.27x18=22.8 6) 2-1.80 ±0.05 17.78 1.80 Back Det ail C (Back) IC Device Dimensions (Refe rence Dra wing) IC Device Dimensions ( Reference Drawing) 98.00 REF . 89.00 ±0.1 1.27x35=44.45 ±0.1 (1.27x17=21.59) (1..
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