DatasheetsPDF.com

K9F2G08Q0M Dataheets PDF



Part Number K9F2G08Q0M
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description FLASH MEMORY
Datasheet K9F2G08Q0M DatasheetK9F2G08Q0M Datasheet (PDF)

K9F2808Q0C-DCB0,DIB0 K9F2808U0C-YCB0,YIB0 K9F2808U0C-DCB0,DIB0 K9F2816Q0C-DCB0,DIB0 K9F2816U0C-YCB0,YIB0 K9F2816U0C-DCB0,DIB0 K9F2808U0C-VCB0,VIB0 FLASH MEMORY Document Title 16M x 8 Bit , 8M x 16 Bit NAND Flash Memory Revision History Revision No. History 0.0 1.0 Initial issue. TBGA PKG Dimension Change 48-Ball, 6.0mm x 8.5mm --> 63-Ball, 9.0mm x 11.0mm 1.A3 Pin assignment of TBGA Package is changed.(Page 4) (before) NC --> (after) Vss 2. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V d.

  K9F2G08Q0M   K9F2G08Q0M


Document
K9F2808Q0C-DCB0,DIB0 K9F2808U0C-YCB0,YIB0 K9F2808U0C-DCB0,DIB0 K9F2816Q0C-DCB0,DIB0 K9F2816U0C-YCB0,YIB0 K9F2816U0C-DCB0,DIB0 K9F2808U0C-VCB0,VIB0 FLASH MEMORY Document Title 16M x 8 Bit , 8M x 16 Bit NAND Flash Memory Revision History Revision No. History 0.0 1.0 Initial issue. TBGA PKG Dimension Change 48-Ball, 6.0mm x 8.5mm --> 63-Ball, 9.0mm x 11.0mm 1.A3 Pin assignment of TBGA Package is changed.(Page 4) (before) NC --> (after) Vss 2. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 32) 3. Add the data protection Vcc guidence for 1.8V device - below about 1.1V. (Page 33) The min. Vcc value 1.8V devices is changed. K9F28XXQ0C : Vcc 1.65V~1.95V --> 1.70V~1.95V Pb-free Package is added. K9F2808U0C-FCB0,FIB0 K9F2808Q0C-HCB0,HIB0 K9F2816U0C-HCB0,HIB0 K9F2816U0C-PCB0,PIB0 K9F2816Q0C-HCB0,HIB0 K9F2808U0C-HCB0,HIB0 K9F2808U0C-PCB0,PIB0 Some AC parameter is changed(K9F28XXQ0C). tWC tWH tWP tRC tREH tRP tREA tCEA Before After 45 60 15 20 25 40 50 60 15 20 25 40 30 40 45 55 Mar. 13rd 2003 Draft Date Apr. 15th 2002 Sep. 5th 2002 Remark Advance Advance 2.0 Dec.10th 2002 Preliminary 2.1 Mar. 6th 2003 2.2 2.3 Mar. 26th 2003 2.4 New definition of the number of invalid blocks is added. May. 24th 2003 (Minimum 502 valid blocks are guaranteed for each contiguous 64Mb memory space) Note : For more detailed features and specifications including FAQ, please refer to Samsung’ s Flash web site. http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. 1 K9F2808Q0C-DCB0,DIB0 K9F2808U0C-YCB0,YIB0 K9F2808U0C-DCB0,DIB0 K9F2816Q0C-DCB0,DIB0 K9F2816U0C-YCB0,YIB0 K9F2816U0C-DCB0,DIB0 K9F2808U0C-VCB0,VIB0 FLASH MEMORY 16M x 8 Bit / 8M x 16 Bit NAND Flash Memory PRODUCT LIST Part Number K9F2808Q0C-D,H K9F2816Q0C-D,H K9F2808U0C-Y,P K9F2808U0C-D,H K9F2808U0C-V,F K9F2816U0C-Y,P K9F2816U0C-D,H 2.7 ~ 3.6V X16 X8 Vcc Range 1.7 ~ 1.95V Organization X8 X16 TSOP1 TBGA WSOP1 TSOP1 TBGA PKG Type TBGA FEATURES • Voltage Supply - 1.8V device(K9F28XXQ0C) : 1.7~1.95V - 3.3V device(K9F28XXU0C) : 2.7 ~ 3.6 V • Organization - Memory Cell Array - X8 device(K9F2808X0C) : (16M + 512K)bit x 8bit - X16 device(K9F2816X0C) : (8M + 256K)bit x 16bit - Data Register - X8 device(K9F2808X0C) : (512 + 16)bit x 8bit - X16 device(K9F2816X0C) : (256 + 8)bit x16bit • Automatic Program and Erase - Page Program - X8 device(K9F2808X0C) : (512 + 16)Byte - X16 device(K9F2816X0C) : (256 + 8)Word - Block Erase : - X8 device(K9F2808X0C) : (16K + 512)Byte - X16 device(K9F2816X0C) : ( 8K + 256)Word • Page Read Operation - Page Size - X8 device(K9F2808X0C) : (512 + 16)Byte - X16 device(K9F2816X0C) : (256 + 8)Word - Random Access : 10µs(Max.) - Serial Page Access : 50ns(Min.) • Fast Write Cycle Time - Program time : 200µs(Typ.) - Block Erase Time : 2ms(Typ.) • Command/Address/Data Multiplexed I/O Port • Hardware Data Protection - Program/Erase Lockout During Power Transitions • Reliable CMOS Floating-Gate Technology - Endurance : 100K Program/Erase Cycles - Data Retention : 10 Years • Command Register Operation • Unique ID for Copyright Protection • Package - K9F28XXU0C-YCB0/YIB0 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - K9F28XXU0C-PCB0/PIB0 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - Pb-free Package - K9F28XXX0C-DCB0/DIB0 63 - Ball TBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm) - K9F28XXX0C-HCB0/HIB0 63 - Ball TBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm) - Pb-free Package - K9F2808U0C-VCB0/VIB0 48 - Pin WSOP I (12X17X0.7mm) - K9F2808U0C-FCB0/FIB0 48 - Pin WSOP I (12X17X0.7mm) - Pb-free Package * K9F2808U0C-V/F(WSOPI ) is the same device as K9F2808U0C-Y/P(TSOP1) except package type. GENERAL DESCRIPTION Offered in 16Mx8bit or 8Mx16bit, the K9F28XXX0C is 128M bit with spare 4M bit capacity. The device is offered in 1.8V or 3.3V Vcc. Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed in typical 200µs on the 528-byte(X8 device) or 264-word(X16 device) page and an erase operation can be performed in typical 2ms on a 16K-byte(X8 device) or 8K-word(X16 device) block. Data in the page can be read out at 50ns cycle time per word. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the writeintensive systems can take advantage of the K9F28XXX0C’ s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F28XXX0C is an optimum solution for large nonvolatile storage applications such .


K9F2816U0C-YIB0 K9F2G08Q0M K9F2G08U0M


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)