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SAI06 Dataheets PDF



Part Number SAI06
Manufacturers Sanken electric
Logo Sanken electric
Description Surface-Mount/ Separate Excitation Switching Type
Datasheet SAI06 DatasheetSAI06 Datasheet (PDF)

SAI Series Switching Type Features q Surface-mount package with high output and efficiency q Requires only 4 external components q Phase correction and output voltage adjustment performed internally q Built-in reference oscillator (60 kHz) q Built-in overcurrent and thermal protection circuits Surface-mount and Separate Excitation Type Applications q For power supplies in telephone sets q For power supplies in office equipment External View s Lineup Type No. SAI01 SAI02 SAI03 SAI04 SAI05 SAI0.

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SAI Series Switching Type Features q Surface-mount package with high output and efficiency q Requires only 4 external components q Phase correction and output voltage adjustment performed internally q Built-in reference oscillator (60 kHz) q Built-in overcurrent and thermal protection circuits Surface-mount and Separate Excitation Type Applications q For power supplies in telephone sets q For power supplies in office equipment External View s Lineup Type No. SAI01 SAI02 SAI03 SAI04 SAI05 SAI06 VO (V) 5 3.3 12 15 13 9 0.4 IO (A) 0.5 s Absolute Maximum Ratings Parameter DC Input Voltage Power Dissipation Junction Temperature Storage Temperature SW Terminal Applied Reverse Voltage Thermal Resistance* (junction-to-case) Symbol VIN PD Tj Tstg VSW Rth(j-c) Ratings 35 0.75 +125 –40 to +125 –1 20 Unit V W °C °C V °C/W * Refer to Outline Drawing for the case temperature measuring points. s Recommended Operating Conditions Ratings Parameter DC Input Voltage Range Output Current Range Operating Junction Temperature Range Symbol VIN IO Tjop SAI01 SAI02 SAI03 SAI04 SAI05 SAI06 7 to 33 5.3 to 33 15 to 33 18 to 33 16 to 33 12 to 33 0 to 0.5 0 to 0.4 –30 to +125 Unit V A °C 5 SAI Series s Electrical Characteristics Ratings Parameter Symbol SAI01 min typ max min Output Voltage VO SAI02 typ max min SAI03 typ max min SAI04 SAI05 SAI06 typ max V Unit typ max min typ max min 4.80 5.00 5.20 3.17 3.30 3.43 11.40 12.00 12.60 14.25 15.00 15.75 12.35 13.00 13.65 8.55 9.00 9.45 Condition VIN=20V, IO=0.3A V IN=15V, I O=0.3A V IN=24V, I O=0.3A VIN =27V, I O=0.3A VIN =25V, IO=0.3A VIN =21V, IO=0.3A Efficiency η 80 75 88 VIN=24V, IO=0.3A 60 VIN=24V, IO=0.3A 100 130 89 VIN=27V, IO =0.3A 60 VIN=27V, IO=0.3A 100 130 88 VIN=25V, IO=0.3A 60 VIN=25V, IO=0.3A 100 130 86 VIN =21V, IO=0.3A 60 VIN =21V, IO=0.3A 90 110 % Condition VIN=20V, IO=0.3A VIN=15V, IO=0.3A Switching Frequency f Condition Line Regulation ∆VOLINE 60 VIN=20V, IO=0.3A 80 100 60 VIN=15V, IO=0.3A 60 80 kHz mV Condition VIN =10 to 30V, IO=0.3A VIN =8 to 30V, IO=0.3A VIN =18 to 30V, IO=0.3A VIN =21 to 30V, IO =0.3A VIN =19 to 30V, IO=0.3A VIN =15 to 30V, IO=0.3A Load Regulation Temperature Coefficient of Output Voltage Ripple Rejection Condition Overcurrent Protection Starting Current IS Condition 0.55 VIN=10V 0.55 VIN =8V 0.45 VIN=18V f=100 to 120Hz 0.45 VIN =21V 0.45 VIN =19V 0.45 A VIN =15V ∆VOLOAD 30 40 20 30 70 95 90 120 75 100 50 80 mV Condition VIN=20V, IO=0.1 to 0.4A VIN=15V, IO=0.1 to 0.4A VIN=24V, IO=0.1 to 0.4A VIN=27V, IO=0.1 to 0.4A VIN =25V, IO=0.1 to 0.4A VIN =21V, IO=0.1 to 0.4A ∆Vo/∆T RREJ ±0.5 45 ±0.5 45 ±1.5 45 ±1.5 45 ±1.5 45 ±1.0 45 dB mV/°C s Outline Drawing (unit:mm) ±0.25 s Block Diagram 2.54 1VIN ±0.15 4.32 4 .GND +0.15 a b 4.7max. ±0.2 3VOS 2 SW 0.75 –0.05 1.4±0.2 6.8 max. VIN 1 Ocp Reg. 2 SW 0.89 3.6 ±0.2 A 8.0 ±0.5 4.0max. 6.3±0.2 Osc Reset Drive Comp. TSD 0.3 –0.05 0.26 +0.15 0~0.1 1.0 ±0.3 3.0 ±0.2 9.8±0.3 a. Type b. Lot number A Case temperature measuring point Amp. 3 VOS VREF 4 GND Plastic Mold Package Type Flammability: UL94V-0 Weight: Approx. 0.22 g Terminal Connections (1) Input (2) Switching output (3) Output Voltage Detection (4) Ground 6 s Standard External Circuit 3.3V 5V : 200µH 12V 13V 15V : 300µH s Ta-PD Characteristics 0.8 0.7 Power Dissipation PD (W) VIN 1 VIN SW L1 2 3 • Glass epoxy substrate (95 × 69 × 1.2) • Natural cooling VOUT 0.6 0.5 0.4 0.3 0.2 0.1 0 -30 DC Input C1 100µF + SAI GND 4 VOS DC Output D1 + C2 330µF SFPB54 (Sanken) GND GND 0 25 50 75 100 125 Ambient temperature Ta (°C) s Example of Printed-circuit board VIN SW 2 1 L1 DI1 + PD = VO • I O 100 VO ηχ –1 –VF • IO 1– VIN SAI 3 + C1 4 GND Vo C 2 a) For optimum operation, there must be only one GND line originating from terminal 4 and each component must be connected with the shortest possible wiring. b) To prevent heating of the IC, it is best to make the GND pattern larger since the internal frame and terminal 4 (GND) are connected to each other. The efficiency depends on the input voltage and the output current. Thus, obtain the value from the efficiency graph on page 8 and substitute the percentage in the formula above. VO : Output voltage IO : Output current ηχ : Efficiency (%) VF : Diode forward voltage SFPB54-0.3V Thermal design for D1 must be performed separately. s Selecting external components 1. Inductor L1 q It must be suited for switching regulators. Do not use inductors for noise filters as they generate excessive heat. w It must have the appropriate inductance value. If the inductance is too small (150µH or lower), abnormal oscillation may occur causing operation problems in the overcurrent protection circuit within the rated current range. e The rated current must be satisfied. If the rated current is exceeded, magnetic saturation leads to overcurrent. 2. Capacitors C1 and C2 q They must satisfy the breakdown voltage and allowable ripple current. Use of these capa.


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