SB2332-H

Semiconductor SB2332-H High Brightness Chip LED Lamp Features Colorless transparency lens type Compact type Radiation size 2.9mm(L)×1.6mm(W) surface mount type High luminosity Applications LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm ± PIN Connections 1. Anode 2. NC 3. Cathode KLB-3001-000 1 SB2332-H Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (Reflow soldering) 1 Symbol PD IF IFP VR Topr Tstg Tsol Ratings 100 25 50 4 -20∼80 -25∼85 240°C for 3 seconds Unit mW mA mA V °C °C *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching) Electrical Characteristics Characteristic Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current *3 Symbol VF IV Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V IF= 20mA Min. - Typ. 3.4 45 470 26 ±60 Max. 4.0 10 - Unit V mcd nm nm uA deg λP ∆λ IR Half Angle θ1/2 *3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity KLB-3001-000 2 SB2332-H Characteristic Diagrams Fig. 1 IF - VF Fig. 2 IV - IF Forward Current IF [mA] Forward Voltage VF [V] Luminous Intensity Iv [mcd] Forward Current IF [mA] Fig....