EESX1109

EE-SX1107/1108/1109/1131 Ultra-Compact Photomicrosensors with Surface-Mount Design Surface mount design, and tape and reel packaging facilitate automated PCB assembly s Compact size makes these sensors ideal for use in applications with restricted space s High-resolution sensing with phototransistor output s s Dual channel model that is ideal for encoder applications (EE-SX1131) Ordering Information Appearance Sensing method Transmissive Slot width 1 mm Slot depth 2 mm Sensing object Opaque 0.15 x 0.6 mm min. Weight 0.05 g Part number EE-SX1107 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1108 3 mm 3.5 mm Opaque 0.5 x 1.0 mm min. 0.1 g EE-SX1109 Dual channel transmissive 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1131 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Specifications s ABSOLUTE MAXIMUM RATING (TA=25°C) Item Emitter Forward current Pulse forward current Reverse voltage Detector Collector-emitter voltage Emitter-collector voltage Collector current Collector dissipation Ambient temperature Operating Storage Soldering (manual) Soldering (reflow) Symbol IF IFP VR VCEO VECO IC PC Topr Tstg Tsol Tsol Rated value 25 mA (see note) 100 mA (duty: 1/100, pulse width: 0.1 ms) 5V 20 V 5V 20 mA 75 mW (see note) -30° to 85°C -40° to 90°C 300°C (3 second max.) 240°C (10 second max) Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range. s CHARACTERISTICS (TA=25°C) Item Emitter Forward voltage Rev...