Document
PD - 9699C
IRFD024
Absolute Maximum Ratings
Parameter
ID @ TA = 25°C ID @ TA = 100°C IDM PD @TA = 25°C
Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V
c Pulsed Drain Current
Power Dissipation
VGS
EAS
dv/dt TJ TSTG
Linear Derating Factor Gate-to-Source Voltage
d Single Pulse Avalanche Energy e Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10sec
Thermal Resistance
Parameter
RθJA
Junction-to-Ambient
Max. 2.5 1.8 20 1.3
0.0083 +/-20 91
4.5 -55 to + 175
Units
A
W W/°C
V mJ V/ns °C
Typ. –––
Max. 120
Units °C/W
08/25/05
IRFD024
2
www.irf.com
IRFD024
www.irf.com
3
IRFD024
4
www.irf.com
IRFD024
1000
Thermal Response ( Z thJA )
100 D = 0.50
0.20
10
0.10
0.05
0.02
1
0.01
0.1
SINGLE PULSE ( THERMAL RESPONSE )
0.01
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com
100
5
IRFD024
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.18//0045
6
www.irf.com
.