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X22C10 Dataheets PDF



Part Number X22C10
Manufacturers Xicor
Logo Xicor
Description Nonvolatile Static RAM
Datasheet X22C10 DatasheetX22C10 Datasheet (PDF)

X22C10 256 Bit X22C10 Nonvolatile Static RAM DESCRIPTION 64 x 4 FEATURES • • • • • • • • High Performance CMOS —120ns RAM Access Time High Reliability —Store Cycles: 1,000,000 —Data Retention: 100 Years Low Power Consumption —Active: 40mA Max. —Standby: 100µA Max. Infinite Array Recall, RAM Read and Write Cycles Nonvolatile Store Inhibit: VCC = 3.5V Typical Fully TTL and CMOS Compatible JEDEC Standard 18-Pin 300-mil DIP 100% Compatible with X2210 —With Timing Enhancements The X22C10 is a 6.

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X22C10 256 Bit X22C10 Nonvolatile Static RAM DESCRIPTION 64 x 4 FEATURES • • • • • • • • High Performance CMOS —120ns RAM Access Time High Reliability —Store Cycles: 1,000,000 —Data Retention: 100 Years Low Power Consumption —Active: 40mA Max. —Standby: 100µA Max. Infinite Array Recall, RAM Read and Write Cycles Nonvolatile Store Inhibit: VCC = 3.5V Typical Fully TTL and CMOS Compatible JEDEC Standard 18-Pin 300-mil DIP 100% Compatible with X2210 —With Timing Enhancements The X22C10 is a 64 x 4 CMOS NOVRAM featuring a high-speed static RAM overlaid bit-for-bit with a nonvolatile E2PROM. The NOVRAM design allows data to be easily transferred from RAM to E2PROM (STORE) and from E2PROM to RAM (RECALL). The STORE operation is completed within 5ms or less and the RECALL is completed within 1µs. Xicor NOVRAMs are designed for unlimited write operations to the RAM, either RECALLs from E2PROM or writes from the host. The X22C10 will reliably endure 1,000,000 STORE cycles. Inherent data retention is greater than 100 years. FUNCTIONAL DIAGRAM PIN CONFIGURATION PLASTIC DIP CERDIP 2 NONVOLATILE E PROM MEMORY ARRAY STORE A0 A1 A2 VCC COLUMN I/O CIRCUITS VSS ROW SELECT STATIC RAM MEMORY ARRAY ARRAY RECALL NC A4 A3 A2 A1 A0 CS VSS STORE 1 2 3 4 5 6 7 8 9 18 17 16 15 X22C10 14 13 12 11 10 VCC NC A5 I/O4 I/O3 I/O2 I/01 WE RECALL 3815 FHD F02 STORE RECALL I/O1 I/O2 I/O3 I/O4 CONTROL LOGIC INPUT DATA CONTROL COLUMN SELECT SOIC A4 A3 A2 A1 A0 CS VSS 3815 FHD F01 1 2 3 4 5 6 7 8 X22C10 16 15 14 13 12 11 10 9 A3 A4 A5 VCC A5 I/O4 I/O3 I/O2 I/O1 WE RECALL 3815 FHD F08.1 CS WE STORE © Xicor, Inc. 1991,1995 Patents Pending 3815-2.4 7/26/96 T0/CO/D3 SH 1 Characteristics subject to change without notice X22C10 PIN DESCRIPTIONS AND DEVICE OPERATION Addresses (A0–A5) The address inputs select a 4-bit memory location during a read or write operation. Chip Select (CS) The Chip Select input must be LOW to enable read or write operations with the RAM array. CS HIGH will place the I/O pins in the high impedance state. Write Enable (WE) The Write Enable input controls the I/O buffers, determining whether a RAM read or write operation is enabled. When CS is LOW and WE is HIGH, the I/O pins will output data from the selected RAM address locations. When both CS and WE are LOW, data presented at the I/O pins will be written to the selected address location. Data In/Data Out (I/O1–I/O4) Data is written to or read from the X22C10 through the I/O pins. The I/O pins are placed in the high impedance state when either CS is HIGH or during either a store or recall operation. STORE The STORE input, when LOW, will initiate the transfer of the entire contents of the RAM array to the E2PROM array. The WE and RECALL inputs are inhibited during the store cycle. The store operation is completed in 5ms or less. A store operation has priority over RAM read/write operations. If STORE is asserted during a read operation, the read will be discontinued. If STORE is asserted during a RAM write operation, the write will be immediately terminated and the store performed. The data at the RAM address that was being written will be unknown in both the RAM and E2PROM arrays. RECALL The RECALL input, when LOW, will initiate the transfer of the entire contents of the E2PROM array to the RAM array. The transfer of data will be completed in 1µs or less. An array recall has priority over RAM read/write operations and will terminate both operations when RECALL is asserted. RECALL LOW will also inhibit the STORE input. Automatic Recall Upon power-up the X22C10 will automatically recall data from the E2PROM array into the RAM array. Write Protection The X22C10 has three write protect features that are employed to protect the contents of the nonvolatile memory. • VCC Sense—All functions are inhibited when VCC is <3.5V typical. • Write Inhibit—Holding either STORE HIGH or RECALL LOW during power-up or power-down will prevent an inadvertent store operation and E2PROM data integrity will be maintained. • Noise Protection—A STORE pulse of typically less than 20ns will not initiate a store cycle. PIN NAMES Symbol A0–A5 I/O1–I/O4 WE CS RECALL STORE VCC VSS NC Description Address Inputs Data Inputs/Outputs Write Enable Chip Select Recall Store +5V Ground No Connect 3815 PGM T01 2 X22C10 ABSOLUTE MAXIMUM RATINGS Temperature under Bias .................. –65°C to +135°C Storage Temperature ....................... –65°C to +150°C Voltage on any Pin with Respect to VSS ....................................... –1V to +7V D.C. Output Current ............................................ 5mA Lead Temperature (Soldering, 10 seconds) .............................. 300°C RECOMMENDED OPERATING CONDITIONS Temperature Commercial Industrial Military Min. 0°C –40°C –55°C Max. +70°C +85°C +125°C 3815 PGM T12.1 COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and the functional operat.


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