VN2222LL

www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by VN2222LL/D TMOS FET Transistor N–Channel — Enhancement 2 GATE 3 DRAIN VN2222LL Motorola Preferred Device 1 SOURCE MAXIMUM RATINGS Rating Drain – Source Voltage Drain–Gate Voltage (RGS = 1.0 MΩ) Gate–Source Voltage — Continuous — Non–repetitive (tp ≤ 50 µs) Drain Current Continuous Pulsed Total Power Dissipation @ TA = 25°C Derate above 25°C Operating and Storage Temperature Range Symbol VDSS VDGR VGS VGSM ID IDM PD TJ, Tstg Value 60 60 ± 20 ± 40 150 1000 400 3.2 – 55 to +150 mW mW/°C °C Unit Vdc Vdc Vdc Vpk mAdc CASE 29–04, STYLE 22 TO–92 (TO–226AA) 1 2 3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Ambient Maximum Lead Temperature for Soldering Purposes, 1/16″ from case for 10 seconds Symbol RθJA TL Max 312.5 300 Unit °C/W °C ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Drain–Source Breakdown Voltage (VGS = 0, ID = 100 µAdc) Zero Gate Voltage Drain Current (VDS = 48 Vdc, VGS = 0) (VDS = 48 Vdc, VGS = 0, TJ = 125°C) Gate–Body Leakage Current, Forward (VGSF = 30 Vdc, VDS = 0) V(BR)DSS IDSS — — IGSSF — 10 500 –100 nAdc 60 — Vdc µAdc ON CHARACTERISTICS(1) Gate Threshold Voltage (VDS = VGS, ID = 1.0 mAdc) Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 0.5 Adc) (VGS = 10 Vdc, ID = 0.5 Vdc, TC = 125°C) 1. Pulse Test: Pulse Width VGS(th) rDS(on) — — 7.5 13.5 0.6 2.5 Vdc Ω v 300 µs, Duty C...