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V23833-G6005-A111 Dataheets PDF



Part Number V23833-G6005-A111
Manufacturers Infineon Technologies
Logo Infineon Technologies
Description XPAK 850 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3
Datasheet V23833-G6005-A111 DatasheetV23833-G6005-A111 Datasheet (PDF)

Fiber Optics XPAK 850 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3 Preliminary Data Sheet Features Standards • Compatible with IEEE Std 802.3ae™-2002 • Compatible with Fibre Channel 10GFC Draft 3.5 • Compatible with XPAK MSA Rev. 2.3 Optical V23833-G2005-A101 V23833-G6005-A101 V23833-G6005-A111 File: 2101 • IEEE Ethernet: Serial 850 nm 10GBASE-SR • T11 Fibre Channel: Serial 850 nm 1200-M5-SN-I; 1200-M5E-SN-I; 1200-M6-SN-I • 10 Gigabit Fibre Channel: 10.51875 G.

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Fiber Optics XPAK 850 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3 Preliminary Data Sheet Features Standards • Compatible with IEEE Std 802.3ae™-2002 • Compatible with Fibre Channel 10GFC Draft 3.5 • Compatible with XPAK MSA Rev. 2.3 Optical V23833-G2005-A101 V23833-G6005-A101 V23833-G6005-A111 File: 2101 • IEEE Ethernet: Serial 850 nm 10GBASE-SR • T11 Fibre Channel: Serial 850 nm 1200-M5-SN-I; 1200-M5E-SN-I; 1200-M6-SN-I • 10 Gigabit Fibre Channel: 10.51875 Gbit/s (V23833-G2005-A101) • 10 Gigabit Ethernet: 10.3125 Gbit/s (V23833-G6005-A1x1) • Transmission distance – up to 82 m1) (50 µm MMF) – up to 300 m1) (on special MMF) • Vertical Cavity Surface Emitting Laser at 850 nm (VCSEL) • LC connector, multimode fiber • Full duplex transmission mode • Eye safety class 1M (IEC 60825-1:A2) File: 2117 1) Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation. Part Number Standard De-Latch Mechanism Bail None 1 Connector LC LC LC Laser Class 1M 1M 1M 2004-05-13 V23833-G2005-A101 Fibre Channel Bail V23833-G6005-A101 Ethernet V23833-G6005-A111 Ethernet Preliminary Product Information V23833-Gx005-A1x1 Applications • DOM – Loss Of Signal from receiver – Supply voltage monitor (+3.3 V, Adaptable Power Supply) – Transmit power – Module temperature – Received power – Transmit bias current monitor Mechanical • Mezzanine profile: 2.68" L x 1.42" W x 0.38" H (68.07 mm x 35.99 mm x 9.8 mm) • Mezzanine module height for PCI card applications mid-board mounting • Separated signal/chassis ground (a common signal/chassis ground module version is available upon request) • Belly-to-belly applications • De-latch mechanism with low extraction force (V23833-Gxxxx-Ax0x only) • Built-in heat sink Electrical • • • • Hot pluggable Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V) Total power consumption: 3.4 W typical XAUI electrical interface – 3.125 Gbit/s Ethernet (V23833-G60xx-xxxx) – 3.1875 Gbit/s Fibre Channel (V23833-G20xx-xxxx) • Management and control via MDIO 2-wire bus • 70-pin connector Applications • • • • • • • • • • 10 Gbit/s Ethernet and Fibre Channel transmission systems for Short Range (SR) Integration on PCI card Mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Core and edge routers Aggregation point for lower date rate XPAK evaluation kit V23833-G9909-Z001 available upon request Preliminary Product Information 2 2004-05-13 V23833-Gx005-A1x1 Pin Configuration Pin Configuration 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 GND GND RESERVED RESERVED GND TX LANE3– TX LANE3+ GND TX LANE2– TX LANE2+ GND TX LANE1– TX LANE1+ GND TX LANE0– TX LANE0+ GND GND GND RX LANE3– RX LANE3+ GND RX LANE2– RX LANE2+ GND RX LANE1– RX LANE1+ GND RX LANE0– RX LANE0+ GND RESERVED RESERVED GND GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 .



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