0.5 Um SCMOS3 Technology
Qualpack TSC87251G2D
Qualification Package
TSC87251G2D / TSC83251G2D
0.5 µm SCMOS3 Technology
TSC87251G2D
0.5 µm SCMO...
Description
Qualpack TSC87251G2D
Qualification Package
TSC87251G2D / TSC83251G2D
0.5 µm SCMOS3 Technology
TSC87251G2D
0.5 µm SCMOS3
1999 October
TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY
Rev. 0 – October 1999
1
Qualpack TSC87251G2D
1. General Information........................................................................................................................... 3 1.1 Product Description............................................................................................................................ 3 2. Technology Information..................................................................................................................... 4 2.1 Wafer Process Technology ................................................................................................................. 4 2.1.1 SCMOS3 0.5um ROM Process ................................................................................................... 4 2.1.2 SCMOS3 NV 0.5um EPROM Process ......................................................................................... 6 2.2 Product Design .................................................................................................................................. 6 2.3 Package Technology .......................................................................................................................... 6 2.3.1 Package description .....................................................................................................
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