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TOTX178S Dataheets PDF



Part Number TOTX178S
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description FIBER OPTIC TRANSMITTING MODULE
Datasheet TOTX178S DatasheetTOTX178S Datasheet (PDF)

TOTX178S FIBER OPTIC TRANSMITTING MODULE TOTX178S FIBER OPTIC TRANSMITTING MODULE FOR DIGITAL AUDIO INTERFACE l Conforms to JEITA Standard CP−1201 (For Digital Audio Interfaces including Fiber Optic inter−connections). l LED is driven by differential circuit. Unit: mm 1. Maximum Ratings (Ta = 25°C) Characteristics Storage Temperature Operating Temperature Supply Voltage Input Voltage Soldering Temperature Symbol Tstg Topr VCC VIN Tsol Rating −40 to 70 −20 to 70 −0.5 to 7 −0.5 to VCC + 0.5 260 .

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TOTX178S FIBER OPTIC TRANSMITTING MODULE TOTX178S FIBER OPTIC TRANSMITTING MODULE FOR DIGITAL AUDIO INTERFACE l Conforms to JEITA Standard CP−1201 (For Digital Audio Interfaces including Fiber Optic inter−connections). l LED is driven by differential circuit. Unit: mm 1. Maximum Ratings (Ta = 25°C) Characteristics Storage Temperature Operating Temperature Supply Voltage Input Voltage Soldering Temperature Symbol Tstg Topr VCC VIN Tsol Rating −40 to 70 −20 to 70 −0.5 to 7 −0.5 to VCC + 0.5 260 (Note 1) Unit °C °C V V °C Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package). 2. Recommended Operating Conditions Characteristics Supply Voltage High−Level Input Voltage Low−Level Input Voltage Symbol VCC VIH VIL Min 4.75 2.0 0 Typ. 5.0 ― ― Max 5.25 VCC 0.8 Unit V V V Handling precaution: The LED’s used in this product contain GaAs (Gallium Arsenide). Care must be taken to protect the safety of people and the environment when scrapping or terminal processing. 1 2001-07-26 TOTX178S 3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V) Characteristics Data Rate Transmission Distance Pulse Width Distortion Fiber Output Power Peak Emission Wavelength Current Consumption High Level Input Voltage Low Level Input Voltage (Note 4) (Note 5) ∆tw Pf λp ICC VIH VIL Symbol Test Condition NRZ Code (Note 2) Min DC 0.2 −30 −21 ― ― 2.0 ― Typ. ― ― ― ― 660 13 ― ― Max 6 5 30 −15 ― 20 ― 0.8 Unit Mb / s m ns dBm nm mA V V Using APF (Note 3)and TORX178S Pulse Width = 165 ns Pulse Cycle = 330 ns CL = 10 pF, Using TORX178S Note 2: LED is on when input signal is high, and off when it is low. The duty factor must be maintained between 25 to 75%. Note 3: All Plastic Fiber (970 / 1000 µm). Note 4: Between input of TOTX178S and output of fiber optic receiving module. Note 5: Measure with a standard optical fiber, peak value. 4. Mechanical Characteristics (Ta = 25°C) Characteristics Insertion Force Withdrawal Force Symbol Test Condition Using TOCP172, Initial value Using TOCP172, Initial value Min ― 5.9 Typ. ― ― Max 39.2 39.2 Unit N N 5. Application Circuit 6. Required Optical Fiber with Fiber Optic Connectors TOCP172−□□B 2 2001-07-26 TOTX178S 7. Precautions during use Maximum rating The maximum ratings are the limit values which must not be exceeded during operation of device. None of these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of devices may never be restored properly. In some extreme cases, the device may be permanently damages. (2) Lifetime of light emitters If an optical module is used for a long period of time, degeneration in the characteristics will mostly be due to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of the LEDs used as the light source. The cause of degradation of the optical output of the LEDs may be defects in wafer crystallization or mold resin stress. The detailed causes are, however, not clear. The lifetime of light emitters is greatly influenced by the operating conditions and the environment in which it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light emitting device and its operating conditions determined, Toshiba recommend that lifetime characteristics be checked. Depending on the environment conditions, Toshiba recommend that maintenance such as regular checks of the amount of optical output in accordance with the condition of operating environment. (3) Soldering Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules are optical components. During soldering, ensure that flux does not contact with the emitting surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering. Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof. As mentioned before, optical modules are optical components. Thus, in principle, soldering where there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that soldering be performed without the optical module mounted on the board. Then, after the board has been cleaned, the optical module should be soldered on to the board manually. If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of flux. In such a cases, be sure to check the devices’reliability. (4) Vibration and shock This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to vibration and shock. In actual equipment, there are sometimes cases in which vibration, shock, or stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of equip.


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