Document
TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
Copyright © 1997, Power Innovations Limited, UK MAY 1989 - REVISED MARCH 1997
q q q q
20 W Pulsed Power Dissipation 100 V Capability 2 A Continuous Collector Current 4 A Peak Collector Current
E C B
LP PACKAGE (TOP VIEW) 1 2 3
MDTRAB
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATING TIPP110 Collector-base voltage (IE = 0) TIPP111 TIPP112 TIPP110 Collector-emitter voltage (IB = 0) Emitter-base voltage Continuous collector current Peak collector current (see Note 1) Continuous base current Continuous device dissipation at (or below) 25°C case temperature (see Note 2) Pulsed power dissipation (see Note 3) Operating junction temperature range Storage temperature range Lead temperature 3.2 mm from case for 10 seconds NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%. 2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C. 3. VCE = 20 V, IC = 1 A, PW = 10 ms, duty cycle ≤ 2%. TIPP111 TIPP112 V EBO IC ICM IB Ptot PT Tj Tstg TL VCEO VCBO SYMBOL VALUE 60 80 100 60 80 100 5 2 4 50 0.8 20 -55 to +150 -55 to +150 260 V A A mA W W °C °C °C V V UNIT
PRODUCT
INFORMATION
Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.
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TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
PARAMETER V (BR)CEO Collector-emitter breakdown voltage Collector-emitter cut-off current Collector-base cut-off current Emitter cut-off current Forward current transfer ratio Collector-emitter saturation voltage Base-emitter voltage Parallel diode forward voltage IC = 10 mA (see Note 4) VCE = 30 V V CE = 40 V V CE = 50 V VCE = 60 V V CE = 80 V V CE = 100 V VEB = VCE = V CE = IB = VCE = IE = 5V 4V 4V 8 mA 4V 4A VBE = 0 V BE = 0 V BE = 0 IB = 0 IB = 0 IB = 0 IC = 0 IC = 1 A IC = 2 A IC = 2 A IC = 2 A IB = 0 (see Notes 4 and 5) (see Notes 4 and 5) (see Notes 4 and 5) (see Notes 4 and 5) 1000 500 2.5 2.8 3.5 V V V TEST CONDITIONS TIPP110 IB = 0 TIPP111 TIPP112 TIPP110 TIPP111 TIPP112 TIPP110 TIPP111 TIPP112 MIN 60 80 100 2 2 2 1 1 1 2 mA mA mA V TYP MAX UNIT
ICEO
ICBO
IEBO hFE VCE(sat) VBE VEC
NOTES: 4. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%. 5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts and located within 3.2 mm from device body.
PRODUCT
INFORMATION
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TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA LP003 (TO-92) 3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LP003 (TO-92) 5,21 4,44 3,43 MIN. 2,67 2,03 4,19 3,17 2,67 2,03 LP003 Falls Within JEDEC TO-226AA Dimensions
Seating Plane
5,34 4,32
1,27 (see Note A) 12,7 MIN. 0,56 0,40
1
3
1,40 1,14 2,67 2,41
2
0,41 0,35
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: Lead dimensions are not controlled in this area.
MDXXAX
PRODUCT
INFORMATION
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TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92) 3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LP003 (TO-92) - Formed Leads Version 5,21 4,44 3,43 MIN. 2,67 2,03 4,19 3,17 2,67 2,03 LP003 Falls Within JEDEC TO-226AA Dimensions
5,34 4,32
4,00 MAX.
0,56 0,40
1
2
3 2,90 2,40 0,41 0,35
2,90 2,40
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXAR
PRODUCT
INFORMATION
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TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
LPR tape dimensions
LP Package (TO-92) Tape (Formed Lead Version)
5,21 4,44 3,43 MIN. 2,67 2,03 5,34 4,32 4,19 3,17 2,67 2,03
4,00 MAX. 0,56 0,40 0,41 0,35
13,70 11,70
32,00 23,00
27,68 17,66
2,50 MIN. 16,50 15,50 11,00 8,50 9,75 8,50
0,50 0,00 19,00 5,50
19,00 17,50
2,90 2,40 2,90 2,40 6,75 5,95 13,00 12,40
ø 4,30 3,70
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXAS
PRODUCT
INFORMATION
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TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes.