TDA8922

INTEGRATED CIRCUITS DATA SHEET TDA8922 2 × 25 W class-D power amplifier Objective specification 2003 Mar 20 Philips Semiconductors Objective specification 2 × 25 W class-D power amplifier CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.4 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 16.5 16.6 16.7 16.8 16.9 16.10 16.11 16.12 16.13 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Pulse width modulation frequency Protections Overtemperature Short-circuit across loudspeaker terminals and to supply lines Start-up safety test Supply voltage alarm Differential audio inputs LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION STATIC CHARACTERISTICS SWITCHING CHARACTERISTICS DYNAMIC AC CHARACTERISTICS (STEREO AND DUAL SE APPLICATION) DYNAMIC AC CHARACTERISTICS (MONO BTL APPLICATION) APPLICATION INFORMATION BTL application Pin MODE Output power estimation External clock Heatsink requirements Output current limiting Pumping effects Reference design PCB information for HSOP24 package Classification Bill of materials for reference design Curves measured in reference design Application schematics 17 18 18.1 18.2 18.2.1 18.2.2 18.3 18.3.1 18.3.2 18.3.3 18.4 19 20 21 PACKAGE OUTLINE SOLDERING TDA8922 Introduction Through-hole mount packages Soldering by dipping or by solder wave Manual soldering Surface mount packages Reflow soldering Wave soldering Manual soldering Suitability o...