power amplifier. TDA8922 Datasheet

TDA8922 amplifier. Datasheet pdf. Equivalent


Part TDA8922
Description 2 x 25 W class-D power amplifier
Feature INTEGRATED CIRCUITS DATA SHEET TDA8922 2 × 25 W class-D power amplifier Objective specification 200.
Manufacture NXP
Datasheet
Download TDA8922 Datasheet


INTEGRATED CIRCUITS DATA SHEET TDA8922 2 × 25 W class-D po TDA8922 Datasheet
TDA8922B 2 × 50 W class-D power amplifier Rev. 01 — 1 October TDA8922B Datasheet
TDA8922C 2 × 75 W class-D power amplifier Rev. 01 — 7 Septemb TDA8922C Datasheet
TDA8922C 2 × 75 W class-D power amplifier Rev. 01 — 7 Septemb TDA8922CJ Datasheet
TDA8922C 2 × 75 W class-D power amplifier Rev. 01 — 7 Septemb TDA8922CTH Datasheet
Recommendation Recommendation Datasheet TDA8922 Datasheet




TDA8922
INTEGRATED CIRCUITS
DATA SHEET
TDA8922
2 × 25 W class-D power amplifier
Objective specification
2003 Mar 20



TDA8922
Philips Semiconductors
2 × 25 W class-D power amplifier
Objective specification
TDA8922
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
16.5
16.6
16.7
16.8
16.9
16.10
16.11
16.12
16.13
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Pulse width modulation frequency
Protections
Overtemperature
Short-circuit across loudspeaker terminals and
to supply lines
Start-up safety test
Supply voltage alarm
Differential audio inputs
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
STATIC CHARACTERISTICS
SWITCHING CHARACTERISTICS
DYNAMIC AC CHARACTERISTICS (STEREO
AND DUAL SE APPLICATION)
DYNAMIC AC CHARACTERISTICS (MONO
BTL APPLICATION)
APPLICATION INFORMATION
BTL application
Pin MODE
Output power estimation
External clock
Heatsink requirements
Output current limiting
Pumping effects
Reference design
PCB information for HSOP24 package
Classification
Bill of materials for reference design
Curves measured in reference design
Application schematics
17
18
18.1
18.2
18.2.1
18.2.2
18.3
18.3.1
18.3.2
18.3.3
18.4
19
20
21
PACKAGE OUTLINE
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2003 Mar 20
2







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)