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TDA8924

NXP

2 x 120 W class-D power amplifier

INTEGRATED CIRCUITS DATA SHEET TDA8924 2 × 120 W class-D power amplifier Objective specification 2003 Jul 28 Philips S...


NXP

TDA8924

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Description
INTEGRATED CIRCUITS DATA SHEET TDA8924 2 × 120 W class-D power amplifier Objective specification 2003 Jul 28 Philips Semiconductors Objective specification 2 × 120 W class-D power amplifier CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.4 9 10 11 12 13 14 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Pulse width modulation frequency Protections Over-temperature Short-circuit across the loudspeaker terminals and to supply lines Start-up safety test Supply voltage alarm Differential audio inputs LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION STATIC CHARACTERISTICS SWITCHING CHARACTERISTICS DYNAMIC AC CHARACTERISTICS (STEREO AND DUAL SE APPLICATION) 15 16 16.1 16.2 16.3 16.4 16.5 16.6 16.7 16.8 16.9 16.10 16.11 16.12 17 18 18.1 18.2 18.3 18.4 18.5 19 20 21 TDA8924 DYNAMIC AC CHARACTERISTICS (MONO BTL APPLICATION) APPLICATION INFORMATION BTL application Pin MODE Output power estimation External clock Heatsink requirements Output current limiting Pumping effects Reference design PCB information for HSOP24 encapsulation Classification Reference design: bill of materials Curves measured in the reference design PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2003 Jul...




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