Processor CASP. TEA6880 Datasheet

TEA6880 CASP. Datasheet pdf. Equivalent

Part TEA6880
Description Up-level Car radio Analog Signal Processor CASP
Feature INTEGRATED CIRCUITS DATA SHEET TEA6880H Up-level Car radio Analog Signal Processor (CASP) Product .
Manufacture NXP
Datasheet
Download TEA6880 Datasheet

INTEGRATED CIRCUITS DATA SHEET TEA6880H Up-level Car radio TEA6880 Datasheet
INTEGRATED CIRCUITS DATA SHEET TEA6880H Up-level Car radio TEA6880H Datasheet
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TEA6880
INTEGRATED CIRCUITS
DATA SHEET
TEA6880H
Up-level Car radio Analog Signal
Processor (CASP)
Product speciļ¬cation
File under Integrated Circuits, IC01
2000 May 08



TEA6880
Philips Semiconductors
Up-level Car radio Analog Signal
Processor (CASP)
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
11.16
FEATURES
General
Stereo decoder and noise blanking
Weak signal processing
Audio pre-amplifier
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM noise blanker
AM noise blanker
Multipath/fading detection and weak signal
control
Tone/volume control
Source selector
Loudness
Volume 1
Treble
Bass
Volume 2
RSA selector
Chime adder
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I2C-BUS PROTOCOL
Read mode: 1st data byte
Read mode: 2nd data byte
Subaddress byte for write
Write mode: subaddress 0H
Write mode: subaddress 1H
Write mode: subaddress 2H
Write mode: subaddress 3H
Write mode: subaddress 4H
Write mode: subaddress 5H
Write mode: subaddress 6H
Write mode: subaddress 7H
Write mode: subaddress 8H
Write mode: subaddress 9H
Write mode: subaddress AH
Write mode: subaddress BH
Write mode: subaddress CH
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
Product speciļ¬cation
TEA6880H
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I2C COMPONENTS
2000 May 08
2





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