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NAND BUFFER. SN54LS37 Datasheet |
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QUAD 2-INPUT NAND BUFFER
SN54/74LS37
VCC
14 13 12 11 10
9
8
QUAD 2-INPUT NAND BUFFER
LOW POWER SCHOTTKY
1234567
GND
GUARANTEED OPERATING RANGES
Symbol
Parameter
VCC
Supply Voltage
TA Operating Ambient Temperature Range
IOH Output Current — High
IOL Output Current — Low
14
1
J SUFFIX
CERAMIC
CASE 632-08
14
1
N SUFFIX
PLASTIC
CASE 646-06
14
1
D SUFFIX
SOIC
CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ
SN74LSXXN
SN74LSXXD
Ceramic
Plastic
SOIC
Min Typ Max Unit
54 4.5 5.0 5.5
74 4.75 5.0 5.25
V
54 – 55 25 125 °C
74 0 25 70
54, 74
– 1.2
mA
54 12 mA
74 24
FAST AND LS TTL DATA
5-91
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SN54 / 74LS37
DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified)
Limits
Symbol
Parameter
Min Typ Max Unit
Test Conditions
VIH Input HIGH Voltage
2.0
V
Guaranteed Input HIGH Voltage for
All Inputs
VIL Input LOW Voltage
54
74
0.7 Guaranteed Input LOW Voltage for
0.8 V All Inputs
VIK
VOH
Input Clamp Diode Voltage
Output HIGH Voltage
54
74
– 0.65
– 1.5
2.5 3.5
2.7 3.5
V VCC = MIN, IIN = – 18 mA
V VCC = MIN, IOH = MAX, VIN = VIH
V or VIL per Truth Table
VOL
Output LOW Voltage
54, 74
74
0.25 0.4
0.35 0.5
V
IOL = 12 mA
VCC = VCC MIN,
VIN = VIL or VIH
V IOL = 24 mA per Truth Table
IIH Input HIGH Current
20
0.1
IIL Input LOW Current
IOS Short Circuit Current (Note 1)
– 30
Power Supply Current
ICC Total, Output HIGH
Total, Output LOW
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
– 0.4
–130
2.0
12
µA VCC = MAX, VIN = 2.7 V
mA VCC = MAX, VIN = 7.0 V
mA VCC = MAX, VIN = 0.4 V
mA VCC = MAX
mA VCC = MAX
AC CHARACTERISTICS (TA = 25°C)
Symbol
tPLH
tPHL
Parameter
Turn-Off Delay, Input to Output
Turn-On Delay, Input to Output
Limits
Min Typ Max
12 24
12 24
Unit
ns
ns
Test Conditions
VCC = 5.0 V, RL = 667 Ω
CL = 45 pF
FAST AND LS TTL DATA
5-92
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Case 751A-02 D Suffix
14-Pin Plastic
SO-14
-A-
14 8
-B- P
0.25 (0.010) M
BM
1 7 PL
7
G C R X 45°
D14 PL
0.25 (0.010) M T B S
AS
SEATING
K PLANE
M
F
J
-A-
14
1
Case 632-08 J Suffix
14-Pin Ceramic Dual In-Line
8
-B-
7
C
L
-T-
SEATING
PLANE
F
G
D 14 PL
N
0.25 (0.010) M T A S
K
M
J 14 PL
0.25 (0.010) M T B S
Case 646-06 N Suffix
14-Pin Plastic
14
1
A
F
HG
8
B
7
NOTE 4
L
C
N
SEATING
D PLANE
K
J
M
NOTES:
1. DIMENSIONS A" AND B" ARE DATUMS AND
T" IS A DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. CONTROLLING DIMENSION: MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
6. 751AĆ01 IS OBSOLETE, NEW STANDARD
751AĆ02.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0°Ă
0.25
7°Ă
5.80
6.20
0.25
0.50
INCHES
MIN MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0°Ă
0.009
7°Ă
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
5. 632Ć01 THRU Ć07 OBSOLETE, NEW STANDARD
632Ć08.
DIM
A
B
C
D
F
G
J
K
L
M
N
MILLIMETERS
MIN MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0°Ă °15 Ă
0.51
1.01
INCHES
MIN MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0°Ă °15 Ă
0.020
0.040
NOTES:
1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L" TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B" DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
5. 646Ć05 OBSOLETE, NEW STANDARD 646Ć06.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN MAX
18.16 19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0° 10°
0.39
1.01
INCHES
MIN MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0° 10°
0.015 0.039
FAST AND LS TTL DATA
5-93
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