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SLP-3131C-81 Dataheets PDF



Part Number SLP-3131C-81
Manufacturers Sanyo Semicon Device
Logo Sanyo Semicon Device
Description 5mm yellow-green contact type LED lamp
Datasheet SLP-3131C-81 DatasheetSLP-3131C-81 Datasheet (PDF)

Ordering number : EN6054 SLP-3131C-81 Infrared LED SLP-3131C-81 ø5mm yellow-green contact type LED lamp Features • GaP yellow green LED • 5.0mmø, round top type lamp • Clear green resin package type • The insertion which made it stick to PCB is possible • High luminous intensity, high reliability and long life • Application : for the general public welfare 0.8 max Note : Material -- lron Coating -- Solder Lead center off : ± 0.4 Unit : mm 2 max (not soldered) 5.4 ø5 5.4 8 ± 0.5 Absolut.

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Ordering number : EN6054 SLP-3131C-81 Infrared LED SLP-3131C-81 ø5mm yellow-green contact type LED lamp Features • GaP yellow green LED • 5.0mmø, round top type lamp • Clear green resin package type • The insertion which made it stick to PCB is possible • High luminous intensity, high reliability and long life • Application : for the general public welfare 0.8 max Note : Material -- lron Coating -- Solder Lead center off : ± 0.4 Unit : mm 2 max (not soldered) 5.4 ø5 5.4 8 ± 0.5 Absolute Maximum Ratings at Ta=25°C (as per JIS C 7032) Parameter Forward Current *1 Pulse Forward Current *2 Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature *3 *1 *2 *3 Symbol IF IFP VR PD Topr Tstg Tsol Rating 25 100 3 70 -25 to +80 -30 to +85 260 Unit mA mA V mW °C °C °C 0.5 31.5 ± 1 0.4 0.4 Anode Cathode (1.5) See forward current derating Pulse width = Max. 10ms Duty ratio = Max. 1 / 10 Max. 5sec., Lead soldering condition : Min. 1.6mm from case (used 1.6mm’t PCB) (2.5) Electrical / Optical Characteristics at Ta=25°C Parameter Symbol Conditions Min. Typ. Foward Voltage VF IF = 20mA 1.7 2.1 Reverse Current IR VR = 3V Luminous Intensity *4 IV IF = 20mA 30 80 Peak Wave length λP IF = 20mA 567 Line Half Width ∆λ IF = 20mA 25 Capacitance CO VO = 0 • F = 1MHz 50 Response Time t 250 *4 Luminous Intensity is measured by J-16 (SONY TEKTRONIX) of which our office possess. Max. 2.8 10 Unit V µA mcd nm nm pF ns SANYO Electric Co.,Ltd. Semiconductor Company TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN 52699 GI, (MI) No.6054 1/4 12.2 ± 0.5 6.5 7.7 SLP-3131C-81 Typical Characteristics CAUTION These shows the electrical and optical characteristics of this products, and not assure this dispersive contents. Forward Current vs. Forward Voltage 30 20 Intensity vs. Temperature (IF : constant) 1.5 Forward Current (mA) 10 Relative Intensity 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 1.0 5 3 2 0.5 1 1.6 --40 --20 0 20 40 60 80 100 Forward Voltage (V) Temperature (°C) Intensity vs. Current 10 1.0 5 Spectrum Relative Intensity 1 0.5 Relative Intensity 2 0.5 0.2 0.1 1 2 5 10 20 50 100 200 0 450 500 550 600 650 Forward Current (mA) Wave Length (nm) Forward Current Derating (Abusolute Maximum Rating) 35 20° 30 30° 40° Directivity 10° 0° 1.0 10° 20° 30° 40° Forward Current (mA) 25 20 15 50° 0.5 60° 70° 80° 0.1 0 10 20 30 40 50 60 70 80 90 100 90° 50° 60° 70° 80° 90° 10 5 Temperature (°C) No.6054 2/4 SLP-3131C-81 PRECAUTIONS (1) Bending a lead should avoid not to cause chip deterioration or so. When bending is necessary, care must be taken considering the following points : q Bending a lead must be done before soldering. w Bending a lead must be done in the states of fixing a lead tight and applying no stress on the resin part; otherwise it may cause troubles such as gold wire breaking. e A lead must be bent at intervals of 1.6mm from the edge of the resin part. r Do not bend the same portion of lead more than twice. (2) Setting a product by a tool such as holder should avoid. When necessary, no stress should be applied to the resin part and lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board. (3) The hole pitch of a circuit board must fit to its lead pitch. (4) When soldering, care must be taken considering the following points : q Do not heat a product under any stress (ex. : twist) to leads. w Do not heat (by soldering, for example) a product in the states of being forced to the resin part. (5) Do not use the flux containing chlorine which may cause corrosion of lead and washing is preferable. When washing is necessary, avoid washing the whole product and wash only the needed part under the following conditions. • Chemicals : Methyl alcohol • Temperature : 45°C max. • Time : 30sec. max. No.6054 3/4 SLP-3131C-81 CAUTION 1. No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or the like, and the failure of which may directly or indirectly cause injury, death or property loss. 2. Anyone purchasing any products described or contained herein for an above-mentioned use shall: 1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees, jointly and severally, against any and all claims and litigation and all damages, costs and expenses associated with such use. 2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. 3. Information (including circuit diagrams and circuit parameters) disclosed herein.


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