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PROTECTION ARRAYS. PACDN2404C Datasheet |
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CALIFORNIA MICRO DEVICES
PACDN2404C
PACDN2408C
PACDN2416C
ESD Protection Arrays, Chip Scale Package
Features
• 4, 8, or 16 transient voltage suppressors in a
single package
• In-system Electrostatic Discharge (ESD)
protection to 18kV contact discharge per
IEC 61000-4-2 international standard
• Compact Chip Scale Package (0.65mm pitch) format
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
Applications
• ESD protection of I/O port connections,
such as cellular phone, PDA, internet appliance
and PC ports
• Protection of interface ports or IC pins which are
exposed to high levels of ESD
• ESD protection of analog video and audio R, L, V
(right, left, video) ports
Product Description
The PACDN2404C, PACDN2408C and PACDN2416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD. The back-to-
back zener connections provide ESD protection in cases
where nodes with AC signals are present.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 18kV using the IEC 61000-4-2
contact discharge method. Using the MIL-STD-883D
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
SCHEMATIC DIAGRAMS
D1 D2 D3
D4 D5
B1 B2 B3
B1 B2 B3 B4 B5
A1 A2 A3
PACDN2404C
A1 A2 A3 A4 A5
PACDN2408C
C1 C2 C3
B1 B2 B3
C4 C5
B4 B5
A1 A2 A3
A4 A5
PACDN2416C
Package
Style
Chip Scale
Chip Scale
Chip Scale
STANDARD PART ORDERING INFORMATION
Ordering Part Number
Bumps
Tape & Reel
6 PACDN2404C/R
10 PACDN2408C/R
20 PACDN2416C/R
© 2000 California Micro Devices Corp. All rights reserved.
7/17/2000 215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
C1230700
www.calmicro.com
1
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CALIFORNIA MICRO DEVICES
PACDN2404C
PACDN2408C
PACDN2416C
S P E C I F I C AT I O N S
(At 25°C unless specified otherwise)
Reverse Stand-off Voltage, I = 10µA
Min Typ
±5.9
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, 10mA
6.0
–9.2
7.6
–7.6
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883D, method 3015)
IEC 61000-4-2, contact discharge method
±30
±18
Clamping voltage during ESD discharge
MIL-STD-883D (Method 3015), 8kV
Positive
Negative
14
–14
Capacitance at 2.5V dc, 1MHz
39
Temperature Range:
Operating
Storage
–40
–65
* ESD applied between channel pin and ground, one at a time. All other channels are open. This
parameter is guaranteed by design and characterization
Max
9.2
–6.0
85
150
Unit
V
V
V
kV
kV
V
V
pF
°C
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
250
EXH PH
Z2 Z3 Z4
Z5 RF
CD
EXH
225
200
175
150
125
100
75
50
25
0 48 97 145 194 242 290 339 387
Time (s)
Typical Solder Reflow Thermal Profile (No Clean Flux)
435
©2000 California Micro Devices Corp. All rights reserved.
2 215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com 7/17/2000
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CALIFORNIA MICRO DEVICES
PACDN2404C
PACDN2408C
PACDN2416C
Package Diagrams
0.252
mm
B
A
0.35mm Dia.
Bumps
1.804mm
0.65
mm
0.65
mm
123
0.252
mm
PACDN2404C
0.252
mm
B
3.104mm
0.65
mm
0.65
mm
A
0.35mm Dia.
Bumps
12345
0.252
mm
PACDN2408C
1.154mm
0.381mm
0.643mm
1.154mm
0.381mm
0.643mm
0.252
mm
3.104mm
0.65
mm
0.65
mm
B
A
0.35mm Dia.
Bumps
12345
0.252
mm
PACDN2416C
2.454mm
0.381mm
0.643mm
Pin Orientation
Components are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part
may be rotated 180° without affecting operation.
© 2000 California Micro Devices Corp. All rights reserved.
7/17/2000 215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
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