Document
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1676G
GENERAL PURPOSE WIDE BNAD AMPLIFIER
DESCRIPTION
The µPC1676G is a silicon monolithic integrated circuit employing small package (4pins mini mold) and designed for use as a wide band amplifier covers from HF band to UHF band.
FEATURES
• Excellent frequency response : 1.2 GHz TYP. @ 3 dB down below flat gain. • High power gain : 22 dB TYP. @ f = 0.5 GHz. • High isolation. • Super small package. • Uni- and low voltage operation : VCC = 5 V • Input and output matching 50 Ω.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Supply Voltage Total Power Dissipation Operating Temperature Storage Temperature VCC PT Topt Tstg 6 200 −40 to +85 −55 to +150 V mW °C °C
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 5 V)
CHARACTERISTIC Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss Maximum Output Level SYMBOL ICC GP NF fu ISL RLin RLout PO 1.0 24 9 6 3 MIN. 14 19 TYP. 19 22 4.5 1.2 28 12 9 5 MAX. 24 24 6.0 UNIT mA dB dB GHz dB dB dB dBm TEST CONDITIONS No Signal f = 0.5 GHz f = 0.5 GHz 3 dB down below flat gain f = 0.5 GHz f = 0.5 GHz f = 0.5 GHz f = 0.5 GHz, Pin = 0 dBm
NEC cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Document No. P12447EJ2V0DS00 (2nd edition) (Previous No. IC-1891) Date Published March 1997 N Printed in Japan
©
1989
µPC1676G
TYPICAL CHARACTERISTICS (TA = 25 °C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 25
ICC-Circuit Current-mA
CIRCUIT CURRENT vs. OPERATING TEMPERATURE 30
ICC-Circuit Current-mA
20
20
15 10 5
10
0 0 1 2 3 4 5 6 VCC-Supply Voltage-V
−50
0
50
100
Topt-Operating Temperature-°C
30
GP-Insertion Power Gain-dB
NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY VCC = 5.5 V 5.0 V GP 4.5 V
GP-Insertion Power Gain-dB
30
INSERTION POWER GAIN vs. FREQUENCY VCC = 5 V TA = −40 °C
10
NF-Noise Figure-dB
20 NF VCC = 5.5 V 10 5.0 V 4.5 V 0 60 100 200 500 1000 2000
20 +25 °C 10 +85 °C
5
0
0
60
100
200
500
1000
2000
f-Frequency-MHz
f-Frequency-MHz
REVERSE INSERTION GAIN vs. FREQUENCY 0
RLin-Input Return Loss-dB RLout-Output Return Loss-dB
INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY VCC = 5 V 0
VCC = 5 V
ISL-Isolation-dB
−10
−10
RLout
−20
−20
RLin
−30 60 100 200 500 1000 2000
−30 60
100
200
500
1000
2000
f-Frequency-MHz
f-Frequency-MHz
2
µPC1676G
OUTPUT POWER vs. INPUT POWER VCC = 5 V f = 500 MHz THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE f1 = 500 MHz f2 = 504 MHz −50 5.5 V
10
IM3-3rd Order Intermodulation Distortion-dBc
Po-Output Power-dBm
−40 5.0 V 4.5 V
0
−30
−10
−20
−20
−30
−20
−10
0
−10 −20
−10 Pout-Output Power of Each Tone-dBm
0
Pin-Input Power-dBm
S-PARAMETER
VCC = 5 V, ZO = 50
f (MHz) 100 200 400 600 800 1000 1200 1400 1600 S11 0.072 0.093 0.175 0.355 0.485 0.387 0.298 0.243 0.208 ∠ S11 −26.5 −63.5 −120.4 −176.4 118.7 77.5 59.2 50.5 47.1 S21 8.955 9.327 11.021 14.504 14.530 9.478 6.301 4.562 3.506 ∠ S21 −15.3 −31.3 −66.2 −114.3 177.1 123.1 85.6 53.8 24.5 S12 0.034 0.035 0.038 0.042 0.037 0.044 0.057 0.070 0.083 ∠ S12 −2.0 −3.4 −8.4 −18.4 −25.7 −20.5 −28.3 −41.5 −56.4 S22 0.220 0.233 0.303 0.408 0.361 0.231 0.251 0.292 0.313 ∠ S22 171.2 161.3 139.4 107.7 65.5 61.6 68.0 61.9 51.5
3
µPC1676G
PACKAGE DIMENSIONS EQUIVALENT CIRCUIT
+VCC
PACKAGE DIMENSIONS (Units: mm)
0.4 −0.05 0.4 −0.05
2.8 −0.3 1.5
2
+0.2
+0.1
+0.1
+0.2 −0.1
OUT
(1.8) 0.95 0.95
2.9±0.2
3 (1.9)
IN
1
4
0.6 −0.05
5°
5°
0.4 −0.05
+0.1
+0.1
GND
0.16 −0.06
+0.2 −3.1
1.1
0.8
5°
0 to 0.1
5°
PIN CONNECTIONS 1. GND 2. OUTPUT 3. VCC 4. INPUT
4
+0.1
µPC1676G
[MEMO]
5
µPC1676G
[MEMO]
6
µPC1676G
[MEMO]
7
µPC1676G
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