3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2749TB
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE...
Description
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2749TB
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The µPC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC is packaged in super minimold package which is smaller than conventional minimold. The µPC2749TB has compatible pin connections and performance to µPC2749T of conventional minimold version. So, in the case of reducing your system size, µPC2749TB is suitable to replace from µPC2749T. This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
High-density surface mounting Supply voltage Noise figure Upper limit operating frequency : 6-pin super minimold package : VCC = 2.7 to 3.3 V : NF = 4.0 dB TYP. @ f = 1.9 GHz : fu = 2.9 GHz TYP. @ 3 dB down below from gain at f = 0.9 GHz
APPLICATION
GPS receiver Wireless LAN
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C1U Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel.
µPC2749TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC2749TB)
Caution Elec...
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