Document
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8112TB
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE
DESCRIPTION
The µPC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The µPC8112TB features high impedance output of open collector. Similar ICs of the µPC2757TB and µPC2758TB feature low impedance output of emitter follower. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size. The µPC8112TB is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Excellent RF performance • • • • • • : IIP3 = –7 dBm@fRFin = 1.9 GHz (reference) IM3 = –88 dBc@PRFin = –38 dBm, 1.9 GHz (reference) Similar conversion gain to µPC2757 and lower noise figure than µPC2758 Minimized carrier leakage : RFIo = –80 dB@fRFin = 900 MHz (reference) RFIo = –55 dB@fRFin = 1.9 GHz (reference) High linearity : PO (sat) = –2.5 dBm TYP.@fRFin = 900 MHz PO (sat) = –3 dBm TYP.@fRFin = 1.9 GHz Low current consumption : ICC = 8.5 mA TYP. Supply voltage : VCC = 2.7 to 3.3 V High-density surface mounting : 6-pin super minimold package
APPLICATIONS
• 1.5 GHz to 1.9 GHz cellular/cordless telephone (PHS, DECT, PDC1.5G and so on) • 800 MHz to 900 MHz cellular telephone (PDC800M and so on)
ORDER INFORMATION
Part Number Package 6-pin super minimold Markings C2K Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3kpcs/reel.
µPC8112TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC8112TB) Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12808EJ2V0DS00 (2nd edition) Date Published June 2000 N CP(K) Printed in Japan
The mark
shows major revised points.
©
1997, 2000
µPC8112TB
PIN CONNECTIONS
Pin No.
(Top View) (Bottom View) 4 5 6 4 5 6 3 2
Pin Name RFinput GND LOinput PS VCC IFoutput
1 2 3 4
1
3 2 1
C2K
5 6
PRODUCT LIN-UP (TA = +25°C, VCC = 3.0 V, ZS = ZL = 50 Ω)
Items Part Number No RF ICC (mA) 5.6 900 MHz 1.5 GHz 1.9 GHz 900 MHz CG SSB · NF SSB · NF SSB · NF (dB) (dB) (dB) (dB) 10 10 13 15 1.5 GHz CG (dB) 15 1.9 GHz CG (dB) 13 900 MHz IIP3 (dBm) −14 1.5 GHz IIP3 (dBm) −14 1.9 GHz IIP3 (dBm) −12
µPC2757T µPC2757TB µPC2758T µPC2758TB µPC8112T µPC8112TB
11
9
10
13
19
18
17
−13
−12
−11
8.5
9
11
1.