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TD62305AFN Dataheets PDF



Part Number TD62305AFN
Manufacturers Toshiba
Logo Toshiba
Description 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER
Datasheet TD62305AFN DatasheetTD62305AFN Datasheet (PDF)

TD62304,305AFN TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304AFN,TD62305AFN 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62304AFN and TD62305AFN are non−inverting transistor arrays, which are comprised of seven NPN darlington buffer-transistor output stages PNP input stages. These devices are Low Level input active drivers and are suitable for operations with a 5-V general purposed logic IC such as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current outp.

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TD62304,305AFN TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304AFN,TD62305AFN 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62304AFN and TD62305AFN are non−inverting transistor arrays, which are comprised of seven NPN darlington buffer-transistor output stages PNP input stages. These devices are Low Level input active drivers and are suitable for operations with a 5-V general purposed logic IC such as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Please observe the thermal condition for using. FEATURES l Package Type : SSOP16 pin l High Sustaining Voltage : VCE (SUS) = 50 V (MIN.) l Output Current (Single Output): IOUT = 500 mA / ch (MAX.) l Low Level Active Input l Input compatible with 5-V TTL and 5-V CMOS Weight: 0.07 g (Typ.) PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER) TD62304AFN TD62305AFN Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2001-07-16 MAXIMUM RATINGS (Ta = 25°C) TD62304,305AFN CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current TD62304 TD62305 Power Dissipation Operating Temperature Storage Temperature VCC VCE (SUS) IOUT VIN IIN PD Topr Tstg −0.5~7.0 −0.5~50 500 −22~VCC + 0.5 −0.5~7 −10 0.78 (Note 1) −40~85 −55~150 V V mA / ch V mA W °C °C Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%) RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT Supply Voltage Output Sustaining Voltage VCC VCE (SUS) DC 1 Circuit 4.5 5.0 5.5 0 ― 50 0 ― 400 V V Output Current Input Voltage Input Voltage (Output On) Input Voltage (Output Off) Power Dissipation TD62304 TD62305 TD62304 TD62305 TD62304 TD62305 Tpw ≤ 25 ms IOUT (Note) 7 Circuit Tj = 120°C Ta = 85°C VIN VIN (ON) VIN (OFF) PD Ta = 85°C Duty = 10% 0 Duty = 50% 0 −20 0 −22 −0.5 (Note ) VCC −0.4 −V0C.C6 ― ― 260 mA / ch ― 65 ― VCC V ― 5.5 ― VCC −3.5 V ― VCC −3.7 ― VCC V ― VCC ― 0.325 W Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40% ) 2 2001-07-16 TD62304,305AFN ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Output Saturation Voltage Input Current Output Current SYMBOL ICEX VCE (sat) IIN (ON) IIN (OFF) TEST CIR− CUIT TEST CONDITION 1 VCC = 5.5 V, VOUT = 50 V Ta = 85°C, IIN = 0 2 VCC = 4.5 V, VIN = VIN (ON) MAX. IOUT = 350 mA VIN = 0.8 V 3 VCC = 5.5V, VIN = 0.4 V VCC = 5.5V, VIN = −20 V 4 MIN ― ― ― ― ― ― Output Voltage TD62304 TD62305 VIN (ON) 5 ― ― Supply Current Supply Current Turn−On Delay Turn−Off Delay ICC (ON) ICC (OFF) tON tOFF 6 VCC = 5.5 V, VIN = 0 V VCC = VIN = 5.5 V 7 VCC = 5 V, CL = 15 pF VOUT = 50 V, RL = 125 Ω ― ― ― ― TYP. MAX UNIT ― 100 1.4 1.4 −0.32 ― ― ― ― 17 ― 0.1 3 2.0 2.2 −0.45 2.6 −40 VCC −2.8 VCC −3.7 22 100 ― ― µA V mA µA V mA µA µs 3 2001-07-16 TEST CIRCUIT 1. ICEX 3. IIN (ON) 5. VIN (ON) 7. tON, tOFF 2. VCE (sat) TD62304,305AFN 4. IIN (OFF) 6. ICC Note 1 Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-16 TD62304,305AFN 5 2001-07-16 PACKAGE DIMENSIONS SSOP16−P−225−0.65B TD62304,305AFN Unit : mm Weight: 0.07 g (Typ.) 6 2001-07-16 TD62304,305AFN RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warr.


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