Document
TD62308AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62308AP,TD62308F,TD62308AF
4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER
The TD62308AP/F/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP input stages. This device is low−level input active driver and is suitable for operation with 5−V TTL, 5−V CMOS and 5−V Microprocessor which have sink current output drivers. Application include relay, hammer, lamp and stepping motor drivers.
FEATURES
l Output current (single output) 1.5 A (Max) l High sustaining voltage output 35 V (Min) (TD62308F)
50 V (Min) (TD62308AP, TD62308AF) l Output clamp diodes l Input compatible with TTL and 5 V CMOS l Low level active inputs l Standard supply voltage l Two VCC terminals VCC1, VCC2 (separated) l GND and SUB terminal = heat sink l Package type−AP : DIP−16 pin l Package type−F, AF : HSOP−16 pin
Weight DIP16−P−300−2.54A : 1.11 g (Typ.) HSOP16−P−300−1.00 : 0.50 g (Typ.)
PIN CONNECTION (TOP VIEW)
TD62308AP
TD62308F, TD62308AF
1 2003-02-26
SCHEMATICS (EACH DRIVER)
TD62308AP/F/AF
Note : The input and output parasitic diodes cannot be used as clamp diodes.
PRECAUTIONS for USING
(1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
(2) If a TD62308AP/F/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. Please adhere to the device’s maximum ratings. Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please adhere to the device’s maximum ratings.
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
Supply Voltage
Output Sustaining Voltage
F AP, AF
Output Current
Input Current
Input Voltage
F Clamp diode Reverse Voltage
AP, AF
Clamp Diode Forward Current
Power Dissipation
AP F, AF
Operating Temperature Storage Temperature
VCC VCE (SUS)
IOUT IIN VIN VR IF
PD
Topr Tstg
−0.5~10 −0.5~35 −0.5~50
1.5 −10 −0.5~30 35 50 1.5 1.47 / 2.7 (Note 1) 0.9 / 1.4 (Note 2) −40~85 −55~150
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%)
UNIT V V
A / ch mA V V A
W
°C °C
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RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
TD62308AP/F/AF
CHARACTERISTIC
SYMBOL
CONDITION
MIN TYP. MAX UNIT
Supply Voltage
VCC
― 4.5 ― 5.5 V
Output Sustaining Voltage
F AP, AF
VCE (SUS)
― ―
0 ― 35 V
0 ― 50
DC 1 circuit, Ta = 25°C
0 ― 1250
Output Current
AP F, AF
IOUT
Tpw = 25 ms 4 circuits Ta = 85°C Tj = 120°C
Duty = 10% Duty = 50% Duty = 10% Duty = 50%
0 ― 1250 0 ― 700 mA / ch 0 ― 1250 0 ― 390
Input Voltage Input Voltage
Output On
VIN VIN (ON)
Output Off VIN (OFF)
― 0 ― 25 V
―
0
―
VCC −3.6
V
―
VCC −1.0
―
VCC
Clamp Diode Reverse Voltage
F AP, AF
VR
― ― ― 35 V
― ― ― 50
Clamp Diode Forward Current
Power Dissipation
AP F, AF
IF ― Ta = 85°C
PD Ta = 85°C
(Note 1) (Note 2)
― ― ―
― 1.25 A ― 1.4
W ― 0.7
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%)
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ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC
Output Leakage Current
AP, AF F
Output Saturation Voltage
SYMBOL ICEX
VCE (sat)
TEST CIR− CUIT
TEST CONDITION
VCE = 50 V, Ta = 25°C
1 VCE = 50 V, Ta = 85°C VCE = 35 V, Ta = 25°C
VCE = 35 V, Ta = 85°C
3 IOUT = 1.25 A IOUT = 0.7 A
Input Voltage
"H" Level VIH ― "L" Level VIL ―
― ―
Input Current
"H" Level "L" Level
Clamp Diode Reverse Current
AP, AF F
Clamp Diode Forward Voltage
Supply Current
Output On Output Off
Turn−On Delay
F AP, AF
IIH IIL IR
VF ICC (ON) ICC (OFF)
tON
Turn−Off Delay
F AP, AF
tON
――
4 VR = 50 V, Ta = 25°C VR = 35 V, Ta = 25°C
5 IF = 1.25 A 2 VCC = 5.5 V, VIN = 0 V
VCC = 5.5 V, VIN = VCC VOUT = 35 V RL = 28 Ω VOUT = 50 V
6 CL = 15 pF RL = 40 Ω VOUT = 35 V RL = 28 Ω VOUT = 35 V RL = 40 Ω
TD62308AP/F/AF
MIN TYP. MAX UNIT
― ― ― ― ― ― VCC −1.6
―
― ― ― ― ― ― ―
― 50 ― 100
µA ― 50 ― 100 ― 1.8
V ― 1.3
―
―
― −0.05
― ― 1.5 8.5 ―
25 VCC −3.6
V
10 µA
−0.36 mA
50 µA
50
2.0 V
12.5 mA / ch
1.0 µA
― 0.2 ― µs
― 5.0 ―
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TEST CIRCUIT 1. ICEX
2. ICC
4. IR
5. VF
6. tON、tOFF
TD62308AP/F/AF
3. VCE (sat)
Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig cap.