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TD62308F Dataheets PDF



Part Number TD62308F
Manufacturers Toshiba
Logo Toshiba
Description 4CH LOW INPUT ACTIVE HIGH-CURRENT DARLINGTON SINK DRIVER
Datasheet TD62308F DatasheetTD62308F Datasheet (PDF)

TD62308AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62308AP,TD62308F,TD62308AF 4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER The TD62308AP/F/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP input stages. This device is low−level input active driver and is suitable for operation with 5−V TTL, 5−V CMOS and 5−V Microprocessor which have sink current output drivers. Application include relay, hammer, lamp an.

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TD62308AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62308AP,TD62308F,TD62308AF 4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER The TD62308AP/F/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP input stages. This device is low−level input active driver and is suitable for operation with 5−V TTL, 5−V CMOS and 5−V Microprocessor which have sink current output drivers. Application include relay, hammer, lamp and stepping motor drivers. FEATURES l Output current (single output) 1.5 A (Max) l High sustaining voltage output 35 V (Min) (TD62308F) 50 V (Min) (TD62308AP, TD62308AF) l Output clamp diodes l Input compatible with TTL and 5 V CMOS l Low level active inputs l Standard supply voltage l Two VCC terminals VCC1, VCC2 (separated) l GND and SUB terminal = heat sink l Package type−AP : DIP−16 pin l Package type−F, AF : HSOP−16 pin Weight DIP16−P−300−2.54A : 1.11 g (Typ.) HSOP16−P−300−1.00 : 0.50 g (Typ.) PIN CONNECTION (TOP VIEW) TD62308AP TD62308F, TD62308AF 1 2003-02-26 SCHEMATICS (EACH DRIVER) TD62308AP/F/AF Note : The input and output parasitic diodes cannot be used as clamp diodes. PRECAUTIONS for USING (1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. (2) If a TD62308AP/F/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. Please adhere to the device’s maximum ratings. Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please adhere to the device’s maximum ratings. MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING Supply Voltage Output Sustaining Voltage F AP, AF Output Current Input Current Input Voltage F Clamp diode Reverse Voltage AP, AF Clamp Diode Forward Current Power Dissipation AP F, AF Operating Temperature Storage Temperature VCC VCE (SUS) IOUT IIN VIN VR IF PD Topr Tstg −0.5~10 −0.5~35 −0.5~50 1.5 −10 −0.5~30 35 50 1.5 1.47 / 2.7 (Note 1) 0.9 / 1.4 (Note 2) −40~85 −55~150 Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%) UNIT V V A / ch mA V V A W °C °C 2 2003-02-26 RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) TD62308AP/F/AF CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Supply Voltage VCC ― 4.5 ― 5.5 V Output Sustaining Voltage F AP, AF VCE (SUS) ― ― 0 ― 35 V 0 ― 50 DC 1 circuit, Ta = 25°C 0 ― 1250 Output Current AP F, AF IOUT Tpw = 25 ms 4 circuits Ta = 85°C Tj = 120°C Duty = 10% Duty = 50% Duty = 10% Duty = 50% 0 ― 1250 0 ― 700 mA / ch 0 ― 1250 0 ― 390 Input Voltage Input Voltage Output On VIN VIN (ON) Output Off VIN (OFF) ― 0 ― 25 V ― 0 ― VCC −3.6 V ― VCC −1.0 ― VCC Clamp Diode Reverse Voltage F AP, AF VR ― ― ― 35 V ― ― ― 50 Clamp Diode Forward Current Power Dissipation AP F, AF IF ― Ta = 85°C PD Ta = 85°C (Note 1) (Note 2) ― ― ― ― 1.25 A ― 1.4 W ― 0.7 Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%) 3 2003-02-26 ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current AP, AF F Output Saturation Voltage SYMBOL ICEX VCE (sat) TEST CIR− CUIT TEST CONDITION VCE = 50 V, Ta = 25°C 1 VCE = 50 V, Ta = 85°C VCE = 35 V, Ta = 25°C VCE = 35 V, Ta = 85°C 3 IOUT = 1.25 A IOUT = 0.7 A Input Voltage "H" Level VIH ― "L" Level VIL ― ― ― Input Current "H" Level "L" Level Clamp Diode Reverse Current AP, AF F Clamp Diode Forward Voltage Supply Current Output On Output Off Turn−On Delay F AP, AF IIH IIL IR VF ICC (ON) ICC (OFF) tON Turn−Off Delay F AP, AF tON ―― 4 VR = 50 V, Ta = 25°C VR = 35 V, Ta = 25°C 5 IF = 1.25 A 2 VCC = 5.5 V, VIN = 0 V VCC = 5.5 V, VIN = VCC VOUT = 35 V RL = 28 Ω VOUT = 50 V 6 CL = 15 pF RL = 40 Ω VOUT = 35 V RL = 28 Ω VOUT = 35 V RL = 40 Ω TD62308AP/F/AF MIN TYP. MAX UNIT ― ― ― ― ― ― VCC −1.6 ― ― ― ― ― ― ― ― ― 50 ― 100 µA ― 50 ― 100 ― 1.8 V ― 1.3 ― ― ― −0.05 ― ― 1.5 8.5 ― 25 VCC −3.6 V 10 µA −0.36 mA 50 µA 50 2.0 V 12.5 mA / ch 1.0 µA ― 0.2 ― µs ― 5.0 ― 4 2003-02-26 TEST CIRCUIT 1. ICEX 2. ICC 4. IR 5. VF 6. tON、tOFF TD62308AP/F/AF 3. VCE (sat) Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig cap.


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