Document
TD62S011AFM
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62S011AFM
1-Channel Sink-Current Driver
The TD62011AFM is a 1-channel noninverting sink-current driver with a PNP transistor at the first stage and a NPN transistor at the second stage. The driver incorporates output clamp diodes used to clamp the counter electromotive force which is generated when driving an inductive load. Because the driver operates by source input current, it is optimal for interfacing with sink-current driven general-purpose CMOS logic ICs and microprocessors. Also it is optimal for driving relays and LEDs. When using the driver, pay attention to the thermal conditions
Features
· · · · · · Ultra-small HSON6 package with heat sink on rear High output withstandard voltage: VCE (SUS) = 50 V (min) Large output current: IOUT = 100 mA (max) Built-in input resistor: RIN = 14 kΩ Input signal: Low Level Active Built-in output clamp diodes
Weight: 0.017 g (typ.)
Pin Connection (top view)
Basic Circuit Diagram
VCC
OUTPUT
1
6
INPUT INPUT 10 kW
20 k9
COMMON 20 k9 1 k9 OUTPUT
COMMON VCC
2
5
P-GND
3
4
GND
P-GND GND
Note 1: Diodes shown using dotted lines are parasitic. Do not use them. Note 2: When using the driver, connect the P-GND pin to the GND pin. Note 3: When using the driver, connect the P-GND pin to the heat sink on the rear of the package.
1
2001-12-05
TD62S011AFM
Maximum Ratings (Ta = 25°C)
Characteristics Supply voltage Collector-emitter voltage Output withstand voltage Output current Input voltage Input current Clamp diode reverse voltage Clamp diode forward current Power dissipation Symbol VCC VCEO VCE (SUS) IOUT VIN IIN VR IF PD (Note 4) Rth (j-a) (Note 4) Saturated thermal resistance Rth (j-c) (Note 5) Operating temperature Storage temperature Topr Tstg 25 -40~85 -55~150 °C °C Rating -0.5~7.0 50 50 100 -0.5~7.0 -10 50 100 0.78 160 °C/W Unit V V V mA V mA V mA W
Note 4: 114.3 ´ 76.2 ´ 1.6 mm glass epoxy film substrate Note 5: When an infinite heat sink is mounted.
Cu heat dissipation pattern 100 mm
2
Recommended Operating Condition (Ta = -40~85°C)
Characteristics Supply voltage Output withstand voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Symbol VCC VCEO IOUT VIN VR IF Test Circuit ¾ ¾ Test Condition Min 4.5 0 ¾ 0 ¾ ¾ Typ. 5.0 Max 5.5 50 100 5.5 50 100 Unit V V mA V V mA
¾ ¾ ¾ ¾ ¾ ¾
¾ ¾ ¾ ¾ ¾
¾ ¾ ¾ ¾
2
2001-12-05
TD62S011AFM
Electrical Characteristics (Ta = 25°C)
Characteristics Output leakage current Symbol ICEX Test Circuit 1 Test Condition VCC = VIN = 5.5 V, VOUT = 50 V VCC = 4.5 V, VIN = 0 V, IOUT = 100 mA VCC = 4.5 V, VIN = 0 V, IOUT = 50 mA VCC = 5.5 V, VIN = 0.4 V VCC = 5.5 V, VIN = 5.5 V VCC = 4.5 V, IOUT = 100 mA VR = 50 V IF = 100 mA VCC = 5.5 V, VIN = 0 V VCC = 5.5 V, VIN = VCC VCC = 5 V, VOUT = 50 V, RL = 625 W, CL = 15 pF Min ¾ ¾ ¾ ¾ ¾ ¾ Typ. ¾ ¾ ¾ -0.44 Max 10 0.3 V 0.15 -0.63 -4.0 VCC - 3.7 10 1.3 6.0 100 mA mA V mA V mA mA ms Unit mA
Output saturation voltage
VCE (sat)
2
Output ON Input current Output OFF Input voltage Clamp diode leakage current Clamp diode forward voltage Power dissipation Turn-on delay Turn-off delay
IIN (ON) IIN (OFF) VIN (ON) IR VF ICC (ON) ICC (OFF) tON tOFF
3 4 5 6 7 8
¾
¾
¾ ¾ ¾
¾
¾ ¾ ¾
¾ 0.2 8.5
9
¾ ¾
¾ ¾
3
2001-12-05
TD62S011AFM
Test Circuit
1. ICEX
VCC OPEN VIN VCE VCE (sat) OPEN ICEX IIN
2. VCE (sat)
VCC OPEN IOUT
3. IIN (ON)
VCC IIN (ON) OPEN VIN OPEN
4. IIN (OFF)
VCC IIN (OFF) OPEN IOUT
5. VIN (ON)
VCC OPEN
6. IR
VCC IR OPEN VR
VIN (ON)
VCE
OPEN
7. VF
VCC VF OPEN IOUT
8. ICC
VCC OPEN ICC OPEN VIN OPEN
4
2001-12-05
TD62S011AFM
9. tON, tOFF
tr INPUT VCC OPEN VOUT 90% INPUT Pulse generator (Note 6) OUTPUT CL = 15 pF (Note 7) 50% 10% 10% 90% 50% 0 tOFF VOH 90% OUTPUT 10% VOL tf 5V
50 ms tON
Note 6: Pulse width 50 ms, Duty cycle 10% Output impedance 50 W, tr < = 5 ns, tf < = 10 ns Note 7: CL includes probe and jig capacitance.
Caution on Application
1. The device does not include protectors such as an overcurrent protector and an overvoltage protector. Applying excessive current or voltage may damage the device. Thus, design with great care to prevent excessive current or voltage from being applied to the device. The device may also be damaged by short-circuits between outputs and power supply/ground. Take care when designing output, VCC and GND line. 2. Be sure to mount the device in the correct orientation. Make sure that the positive and negative power supply pins are connected the right way round. Otherwise, the absolute maximum current and power dissipation ratings may be exceeded and the device may break down or undergo performance degradation, causing it to catch fire or explode, and resulting in injury.
5
2001-12-05
TD62S011AFM
Package Dimensions
Weight: 0.017 g (typ.)
6
2001-12-05
TD62S011AFM
Preliminary land pattern
1.6 0.7 0.25 1.6 1.3 0.7 0.6 2.2 0.6 Unit : mm 10 mm
Preliminary PCB trace dimension
0.7
5 mm
7
2001-12-05
TD62S011AFM
RES.