Document
TDA1308
Class-AB stereo headphone driver
Rev. 5 — 14 March 2011
Product data sheet
1. General description
The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications.
2. Features and benefits
Wide temperature range No switch ON/OFF clicks Excellent power supply ripple rejection Low power consumption Short-circuit resistant High performance
High signal-to-noise ratio High slew rate Low distortion Large output voltage swing
3. Quick reference data
Table 1. Quick reference data VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max
VDD supply voltage single supply dual supply
3.0 5.0 7.0 1.5 2.5 3.5
VSS
negative supply
dual supply
voltage
−1.5 −2.5 −3.5
IDD supply current no load
Ptot total power dissipation
no load
- 35 - 15 25
Po THD+N
output power
total harmonic distortion-plus-noise
maximum; THD+N < 0.1 %
[1] [1] [1] -
40 80 0.03 0.06 −70 −65
RL = 5 kΩ S/N signal-to-noise ratio
- −101 100 110 -
Unit V V V
mA mW
mW % dB dB dB
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
Table 1. Quick reference data …continued VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max
αcs channel separation RL = 5 kΩ
[1] -
70 105 -
PSRR
power supply ripple fi = 100 Hz;
rejection
Vripple(p-p) = 100 mV
- 90 -
Tamb
ambient temperature
−40 -
+85
Unit dB dB dB
°C
[1] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).
4. Ordering information
Table 2. Ordering information
Type number Package
Name
Description
TDA1308T SO8
plastic small outline package; 8 leads; body width 3.9 mm
TDA1308TT TSSOP8
plastic thin shrink small outline package; 8 leads; body width 3 mm
Version SOT96-1
SOT505-1
5. Block diagram
Fig 1. Block diagram
OUTA
INAINA+
1
2 3
VSS 4
TDA1308
8 VDD
7 OUTB
6 INB5 INB+
mka779
TDA1308
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
© NXP B.V. 2011. All rights reserved.
2 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
6. Pinning information
6.1 Pinning
Fig 2. Pin configuration
TDA1308
OUTA 1 INA- 2 INA+ 3 VSS 4
8 VDD 7 OUTB 6 INB5 INB+
001aaf782
6.2 Pin description
Table 3. Symbol OUTA INA− INA+ VSS INB+ INB− OUTB VDD
Pin description Pin Description 1 output A 2 inverting input A 3 non-inverting input A 4 negative supply 5 non-inverting input B 6 inverting input B 7 output B 8 positive supply
7. Internal circuitry
TDA1308
Product data sheet
VDD
I1
INA/B+ INA/B-
OUTA/B
M1 M2
D1 D2
M4 D3 D4
VSS
Fig 3. Equivalent schematic diagram
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
M5
A1 M3
Cm A2
M6
mka781
© NXP B.V. 2011. All rights reserved.
3 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VDD tsc
Tstg Tamb VESD
supply voltage short-circuit duration time
storage temperature ambient temperature electrostatic discharge voltage
0
output; Tamb = 25 °C; Ptot = 1 W
20 −65
−40
HBM
[1] −2
MM [2] −200
Max 8.0 -
+150 +85 +2 +200
Unit V s
°C °C kV V
[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative. [2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 5. Symbol Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions SO8 TSSOP8
Typ Unit 210 K/W 220 K/W
TDA1308
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
© NXP B.V. 2011. All rights reserved.
4 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
10. Characteristics
Table 6. Characteristics VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Supplies
VDD supply voltage
single supply dual supply
3.0 1.5
VSS negative supply voltage IDD supply current Ptot total power dissipation Static characteristics
dual supply no load no load
−1.5 -
|VI(offset)|
input offset voltage
IIB input bias current
Vcm common-mode voltage
Gv(ol)
open-loop voltage gain
RL = 5 kΩ
IO output current
maximum
Ro output resistance
THD+N < 0.1 %
ΔVO output voltage variation
RL = 16 Ω
RL = 5 kΩ
αcs channel separation
RL = 5 kΩ
PSRR
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
CL load capacitance
Dynamic characteristics
0 [1] 0.75 [1] 1.5 [1] 0.1 [1] -
THD+N
total harmonic dis.