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TDA1308 Dataheets PDF



Part Number TDA1308
Manufacturers NXP
Logo NXP
Description Class AB stereo headphone driver
Datasheet TDA1308 DatasheetTDA1308 Datasheet (PDF)

TDA1308 Class-AB stereo headphone driver Rev. 5 — 14 March 2011 Product data sheet 1. General description The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. 2. Features and benefits „ Wide temperature range „ No switch ON/OFF clicks „ Excellent power supply ripple rejectio.

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TDA1308 Class-AB stereo headphone driver Rev. 5 — 14 March 2011 Product data sheet 1. General description The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. 2. Features and benefits „ Wide temperature range „ No switch ON/OFF clicks „ Excellent power supply ripple rejection „ Low power consumption „ Short-circuit resistant „ High performance ‹ High signal-to-noise ratio ‹ High slew rate ‹ Low distortion „ Large output voltage swing 3. Quick reference data Table 1. Quick reference data VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Min Typ Max VDD supply voltage single supply dual supply 3.0 5.0 7.0 1.5 2.5 3.5 VSS negative supply dual supply voltage −1.5 −2.5 −3.5 IDD supply current no load Ptot total power dissipation no load - 35 - 15 25 Po THD+N output power total harmonic distortion-plus-noise maximum; THD+N < 0.1 % [1] [1] [1] - 40 80 0.03 0.06 −70 −65 RL = 5 kΩ S/N signal-to-noise ratio - −101 100 110 - Unit V V V mA mW mW % dB dB dB NXP Semiconductors TDA1308 Class-AB stereo headphone driver Table 1. Quick reference data …continued VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Min Typ Max αcs channel separation RL = 5 kΩ [1] - 70 105 - PSRR power supply ripple fi = 100 Hz; rejection Vripple(p-p) = 100 mV - 90 - Tamb ambient temperature −40 - +85 Unit dB dB dB °C [1] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB). 4. Ordering information Table 2. Ordering information Type number Package Name Description TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm Version SOT96-1 SOT505-1 5. Block diagram Fig 1. Block diagram OUTA INAINA+ 1 2 3 VSS 4 TDA1308 8 VDD 7 OUTB 6 INB5 INB+ mka779 TDA1308 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 14 March 2011 © NXP B.V. 2011. All rights reserved. 2 of 17 NXP Semiconductors TDA1308 Class-AB stereo headphone driver 6. Pinning information 6.1 Pinning Fig 2. Pin configuration TDA1308 OUTA 1 INA- 2 INA+ 3 VSS 4 8 VDD 7 OUTB 6 INB5 INB+ 001aaf782 6.2 Pin description Table 3. Symbol OUTA INA− INA+ VSS INB+ INB− OUTB VDD Pin description Pin Description 1 output A 2 inverting input A 3 non-inverting input A 4 negative supply 5 non-inverting input B 6 inverting input B 7 output B 8 positive supply 7. Internal circuitry TDA1308 Product data sheet VDD I1 INA/B+ INA/B- OUTA/B M1 M2 D1 D2 M4 D3 D4 VSS Fig 3. Equivalent schematic diagram All information provided in this document is subject to legal disclaimers. Rev. 5 — 14 March 2011 M5 A1 M3 Cm A2 M6 mka781 © NXP B.V. 2011. All rights reserved. 3 of 17 NXP Semiconductors TDA1308 Class-AB stereo headphone driver 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min VDD tsc Tstg Tamb VESD supply voltage short-circuit duration time storage temperature ambient temperature electrostatic discharge voltage 0 output; Tamb = 25 °C; Ptot = 1 W 20 −65 −40 HBM [1] −2 MM [2] −200 Max 8.0 - +150 +85 +2 +200 Unit V s °C °C kV V [1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative. [2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative. 9. Thermal characteristics Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions SO8 TSSOP8 Typ Unit 210 K/W 220 K/W TDA1308 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 14 March 2011 © NXP B.V. 2011. All rights reserved. 4 of 17 NXP Semiconductors TDA1308 Class-AB stereo headphone driver 10. Characteristics Table 6. Characteristics VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Min Supplies VDD supply voltage single supply dual supply 3.0 1.5 VSS negative supply voltage IDD supply current Ptot total power dissipation Static characteristics dual supply no load no load −1.5 - |VI(offset)| input offset voltage IIB input bias current Vcm common-mode voltage Gv(ol) open-loop voltage gain RL = 5 kΩ IO output current maximum Ro output resistance THD+N < 0.1 % ΔVO output voltage variation RL = 16 Ω RL = 5 kΩ αcs channel separation RL = 5 kΩ PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV CL load capacitance Dynamic characteristics 0 [1] 0.75 [1] 1.5 [1] 0.1 [1] - THD+N total harmonic dis.


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