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HYM72V1620GS-50- Dataheets PDF



Part Number HYM72V1620GS-50-
Manufacturers Siemens
Logo Siemens
Description 16M x 72-Bit Dynamic RAM Module
Datasheet HYM72V1620GS-50- DatasheetHYM72V1620GS-50- Datasheet (PDF)

16M × 72-Bit Dynamic RAM Module (ECC - Module ) HYM 72V1620GS-50/-60 HYM 72V1630GS-50/-60 • 168 Pin JEDEC Standard, Buffered 8 Byte Dual In-Line Memory Module for PC main memory applications 1 bank 16M x 72 organisation Optimized for ECC applications Fast Page Mode Operation Performance:: -50 tRAC tCAC tAA tRC tPC RAS access time CAS access time Access time from address Read/Write cycle time Fast page mode cycle time 50 18 30 90 35 -60 60 20 35 110 40 ns ns ns ns ns • • • • • • • • • • • • .

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16M × 72-Bit Dynamic RAM Module (ECC - Module ) HYM 72V1620GS-50/-60 HYM 72V1630GS-50/-60 • 168 Pin JEDEC Standard, Buffered 8 Byte Dual In-Line Memory Module for PC main memory applications 1 bank 16M x 72 organisation Optimized for ECC applications Fast Page Mode Operation Performance:: -50 tRAC tCAC tAA tRC tPC RAS access time CAS access time Access time from address Read/Write cycle time Fast page mode cycle time 50 18 30 90 35 -60 60 20 35 110 40 ns ns ns ns ns • • • • • • • • • • • • • Single + 3.3V ( ± 0.3V) supply CAS-before-RAS refresh, RAS-only-refresh Decoupling capacitors mounted on substrate All inputs, outputs and clock fully LVTTL & LVCMOS compatible 4 Byte interleave enabled, Dual Address inputs (A0/B0) Buffered inputs excepts RAS and DQ Parallel Presence Detects Utilizes eighteen 16M × 4 -DRAMs and four BiCMOS buffers/line drivers Two versions : HYM 72V1620GS with TSOPII-components (4 mm thickness) HYM 72V1630GS with SOJ-components (9 mm thickness) 8192 refresh cycles / 128 ms with 13 / 11 addressing Gold contact pad Double sided module with 38.0 mm (1500 mil) height • • • Semiconductor Group 1 6.96 HYM72V1620/30GS-50/-60 16M x 72-ECC Module The HYM 72V1600/10GS-50/-60 is a 128 MByte DRAM module organized as 16 777 216 words by 72-bit in a 168-pin, dual read-out, single-in-line package comprising eighteen HYB 3164400AT/AJ 16M × 4 DRAMs in 400 mil wide TSOPII or SOJ- packages mounted together with ceramic decoupling capacitors on a PC board. All inputs except RAS and DQ are buffered by using BiCMOS buffers/line drivers. Each HYB 3164400AT/AJ is described in the data sheet and is fully electrically tested and processed according to Siemens standard quality procedure prior to module assembly. After assembly onto the board, a further set of electrical tests is performed. The density and speed of the module can be detected by the use of presence detect pins. Ordering Information Type HYM 72V1620GS-50 HYM 72V1620GS-60 HYM 72V1630GS-50 HYM 72V1630GS-60 Pin Names A0-A12,B0 DQ0 - DQ71 RAS0, RAS2 CAS0 , CAS2 WE0, WE2 OE0, OE2 Vcc Vss PD1 - PD8 PDE ID0 , ID1 N.C. Presence-Detect and ID-pin Truth Table: Module ID0 ID1 Vss Vss PD1 1 1 PD2 1 1 PD3 1 1 PD4 1 1 PD5 0 0 PD6 0 1 PD7 0 1 PD8 0 0 Address Input Data Input/Output Row Address Strobe Column Address Strobe Read / Write Input Output Enable Power (+3.3 Volt) Ground Presence Detect Pins Presence Detect Enable ID indentification bit No Connection Ordering Code Package L-DIM-168-9 L-DIM-168-9 L-DIM-168-9 L-DIM-168-9 Descriptions 3.3V 50ns DRAM module 3.3V 60ns DRAM module 3.3V 50ns DRAM module 3.3V 60ns DRAM module HYM 72V1620/30GS-50 Vss HYM 72V1620/30GS-60 Vss Note: 1 = High Level ( Driver Output) , 0 = Low Level (Driver Output) for PDE active ( ground) . For PDE at a high level all PD terminal are in tri-state. Semiconductor Group 2 HYM72V1620/30GS-50/-60 16M x 72-ECC Module Pin Configuration PIN # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 Symbol VSS DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VCC DQ14 DQ15 DQ16 DQ17 VSS NC NC VCC WE0 CAS0 NC RAS0 OE0 VSS A0 A2 A4 A6 A8 A10 A12 VCC NC NC PIN # 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 Symbol VSS OE2 RAS2 CAS4 NC WE2 VCC NC NC DQ18 DQ19 VSS DQ20 DQ21 DQ22 DQ23 VCC DQ24 NC NC NC NC DQ25 DQ26 DQ27 VSS DQ28 DQ29 DQ30 DQ31 VCC DQ32 DQ33 DQ34 DQ35 VSS PD1 PD3 PD5 PD7 ID0 (VSS) VCC PIN # 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 Symbol VSS DQ36 DQ37 DQ38 DQ39 VCC DQ40 DQ41 DQ42 DQ43 DQ44 VSS DQ45 DQ46 DQ47 DQ48 DQ49 VCC DQ50 DQ51 DQ52 DQ53 VSS NC NC VCC NC NC NC NC NC VSS A1 A3 A5 A7 A9 A11 NC VCC NC B0 PIN # 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 Symbol VSS NC NC NC NC PDE VCC NC NC DQ54 DQ55 VSS DQ56 DQ57 DQ58 DQ59 VCC DQ60 NC NC NC NC DQ61 DQ62 DQ63 VSS DQ64 DQ65 DQ66 DQ67 VCC DQ68 DQ69 DQ70 DQ71 VSS PD2 PD4 PD6 PD8 ID1 (VSS) VCC Semiconductor Group 3 HYM72V1620/30GS-50/-60 16M x 72-ECC Module RAS0 CAS0 WE0 OE0 RAS2 CAS4 WE2 OE2 DQ0-DQ3 I/O1-I/O4 D0 DQ36-DQ39 I/O1-I/O4 D9 DQ4-DQ7 I/O1-I/O4 D1 DQ40-DQ43 I/O1-I/O4 D10 DQ8-DQ11 I/O1-I/O4 D2 DQ44-DQ47 I/O1-I/O4 D11 DQ12-DQ15 I/O1-I/O4 D3 DQ48-DQ51 I/O1-I/O4 D12 DQ16-DQ19 I/O1-I/O4 D4 DQ52-DQ55 I/O1-I/O4 D13 DQ20-DQ23 I/O1-I/O4 D5 DQ56-DQ59 I/O1-I/O4 D14 DQ24-DQ27 I/O1-I/O4 D6 DQ60-DQ63 I/O1-I/O4 D15 DQ28-DQ31 I/O1-I/O4 D7 DQ64-DQ67 I/O1-I/O4 D16 DQ32-DQ35 I/O1-I/O4 D8 DQ68-DQ71 I/O1-I/O4 D17 A0 B0 A1-A12 D0 - D8 D9 - D17 D0 - D17 Vcc Vss D0-D17, buffers PDE Vcc or Vss PD1-PD8 Block Diagram Semiconductor Group 4 HYM72V1620/30GS-50/-60 16M x 72-ECC Module Absolute Maximum Rati.


HYM72V1620GS-50 HYM72V1620GS-50- HYM72V1620GS-60


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