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HYS64D128021HBDL-6-B Dataheets PDF



Part Number HYS64D128021HBDL-6-B
Manufacturers Infineon
Logo Infineon
Description 200-Pin Small Outline Dual-In-Line Memory Modules
Datasheet HYS64D128021HBDL-6-B DatasheetHYS64D128021HBDL-6-B Datasheet (PDF)

Data Sheet, Rev. 0.5, Dez. 2003 HYS64D128021[G/H]BDL–5–B HYS64D128021[G/H]BDL–6–B 200-Pin Small Outline Dual-In-Line Memory Modules SO-DIMM DDR SDRAM Green Product Lead Containing Product Memory Products N e v e r s t o p t h i n k i n g . Edition 2003-12 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be c.

  HYS64D128021HBDL-6-B   HYS64D128021HBDL-6-B


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Data Sheet, Rev. 0.5, Dez. 2003 HYS64D128021[G/H]BDL–5–B HYS64D128021[G/H]BDL–6–B 200-Pin Small Outline Dual-In-Line Memory Modules SO-DIMM DDR SDRAM Green Product Lead Containing Product Memory Products N e v e r s t o p t h i n k i n g . Edition 2003-12 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. N e v e r s t o p t h i n k i n g . HYS64D128021[H/G]BDL–[5/6]–B Small Outline DDR SDRAM Modules Overview Table 2 Type PC3200 (CL=3) HYS64D128021GBDL–5–B PC2700 (CL=2.5) HYS64D128021GBDL–6–B PC2700S-2533–0–Z two ranks 1 GB SO-DIMM 512 MBit (×8) PC3200S–3033–1–Z two ranks 1 GB SO-DIMM 512 MBit (×8) Ordering Information Compliance Code Description SDRAM Technology PC3200 (CL=3) HYS64D128021HBDL–5–B PC2700 (CL=2.5) HYS64D128021HBDL–6–B Note: 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. 2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD1) latency of 3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card used for this module. PC2700S-2533–0–Z two ranks 1 GB SO-DIMM 512 MBit (×8) PC3200S–3033–1–Z two ranks 1 GB SO-DIMM 512 MBit (×8) 1) RCD: Row-Column-Delay Data Sheet 7 Rev. 0.5, 2003-12 HYS64D128021[H/G]BDL–[5/6]–B Small Outline DDR SDRAM Modules Pin Configuration 2 Table 3 Symbol A0 - A12 BA0, BA1 DQ0 - DQ63 Pin Configuration Pin Definitions and Functions Type1) I I I/O I I I/O I I I I PWR GND PWR PWR AI PWR I I/O I NC NU Function Address Inputs Bank Address Data Input/Output Command Input Clock Enable SDRAM Data Strobe SDRAM Clock (true signal) SDRAM Clock (complementary signal) Data Mask Chip Select Power (+ 2.5 V) Ground I/O Driver power supply VDD Indentification flag I/O reference supply Serial EEPROM power supply Serial bus clock Serial bus data line slave address select Not Connected Not Usable, reserved for future use RAS, CAS, WE CKE0 - CKE1 DQS0 - DQS7 CK0 - CK1, CK0 - CK1 DM0 - DM8 S0, S1 VDD VSS VDDQ VDDID VREF VDDSPD SCL SDA SA0 - SA2 NC NU 2) 1) I: Input; O: Output; I/O: bidirectional In-/Output; AI: Analog Input; PWR: Power Supply; GND: Signal Ground; NC: Not Connected; NU: Not Usable 2) CKE1 and S1 are used on two bank modules only Data Sheet 8 Rev. 0.5, 2003-12 HYS64D128021[H/G]BDL–[5/6]–B Small Outline DDR SDRAM Modules Pin Configuration Table 4 Front side Pin # 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Symbol Pin Configuration Back side Pin # 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Key 41 43 45 47 49 51 53 55 57 59 61 63 DQ16 DQ17 42 44 46 48 50 52 54 56 58 60 62 64 DQ20 DQ21 Symbol Front side Pin # 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 121 123 125 127 129 131 Symbol DQ26 DQ27 Back side Pin # 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 Symbol DQ30 DQ31 Front side Pin # 133 135 137 139 141 143 145 147 149 151 153 155 157 159 161 163 165 167 169 171 173 175 177 179 181 183 185 187 189 191 193 195 197 199 Symbol DQS4 DQ34 Back side Pin # 134 136 138 140 142 144 146 148 150 152 154 156 158 160 162 164 166 168 170 172 174 176 178 180 182 184 186 188 190 192 194 196 198 200 Symbol DM4 DQ38 VREF VSS DQ0 DQ1 VREF VSS DQ4 DQ5 VDD (CB0) (CB1) VDD (CB4) (CB5) VSS DQ35 DQ40 VSS DQ39 DQ44 VDD DQS0 D.


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