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MAX4717 Dataheets PDF



Part Number MAX4717
Manufacturers Maxim
Logo Maxim
Description Dual SPDT Analog Switches
Datasheet MAX4717 DatasheetMAX4717 Datasheet (PDF)

19-2627; Rev 0; 10/02 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP General Description The MAX4717/MAX4718 low-voltage, low on-resistance (RON), dual single-pole/double throw (SPDT) analog switches operate from a single +1.8V to +5.5V supply. These devices are designed for USB 1.1 and audio switching applications. The MAX4717 features two 4.5 Ω R ON (max) SPDT switches with 1.2Ω flatness and 0.3Ω matching between channels. The MAX4718 features one 4.5Ω RON (max) SPDT switch and.

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19-2627; Rev 0; 10/02 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP General Description The MAX4717/MAX4718 low-voltage, low on-resistance (RON), dual single-pole/double throw (SPDT) analog switches operate from a single +1.8V to +5.5V supply. These devices are designed for USB 1.1 and audio switching applications. The MAX4717 features two 4.5 Ω R ON (max) SPDT switches with 1.2Ω flatness and 0.3Ω matching between channels. The MAX4718 features one 4.5Ω RON (max) SPDT switch and one 20Ω RON (max) SPDT switch. The 20Ω switch has a guaranteed matching and flatness of 0.4Ω and 1.2Ω, respectively. These switches offer breakbefore-make switching (1ns) with tON <80ns and tOFF <40ns at +2.7V. The digital logic inputs are +1.8V logic compatible with a +2.7V to +3.6V supply. These switches are packaged in a chip-scale package (UCSP™), significantly reducing the required PC board area. The chip occupies only a 2.0mm ✕ 1.50mm area and has a 4 ✕ 3 bump array with a bump pitch of 0.5mm. These switches are also available in a 10-pin µMAX package. Features o USB 1.1 Signal Switching Compliant o 2ns (max) Differential Skew o -3dB Bandwidth: >300MHz o Low 15pF On-Channel Capacitance o Single-Supply Operation from +1.8V to +5.5V o 4.5Ω RON (max) Switches (MAX4717/MAX4718) 0.3Ω (max) RON Match (+3.0V Supply) 1.2Ω (max) Flatness (+3.0V Supply) o 20Ω RON (max) Switch (MAX4718) 0.4Ω (max) RON Match (+3.0V Supply) 1.2Ω (max) Flatness (+3.0V Supply) o Rail-to-Rail® Signal Handling o High Off-Isolation: -55dB (10MHz) o Low Crosstalk: -80dB (10MHz) o Low Distortion: 0.03% o +1.8V CMOS-Logic Compatible o <0.5nA Leakage Current at +25°C MAX4717/MAX4718 Applications USB 1.1 Signal Switching Circuits Battery-Operated Equipment Audio/Video-Signal Routing Headphone Switching Low-Voltage Data-Acquisition Systems Sample-and-Hold Circuits Cell Phones PDAs UCSP is a trademark of Maxim Integrated Products, Inc. Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd. PART MAX4717EUB MAX4717EBC-T* MAX4718EUB MAX4718EBC-T* Ordering Information TEMP RANGE -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C PIN/BUMPPACKAGE 10 µMAX 12 UCSP-12 10 µMAX 12 UCSP-12 TOP MARK — ABH — ABI Note: UCSP package requires special solder temperature profile described in the Absolute Maximum Ratings section. *UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. See the UCSP reliability notice in the UCSP Reliability section of this data sheet for more information. Pin Configurations/Functional Diagrams/Truth Tables TOP VIEW (BUMP SIDE DOWN) NC1 IN1 COM1 NO1 MAX4717/MAX4718 GND C1 C2 C3 B1 A1 A2 A3 NC2 IN2 PART MAX4717 MAX4718 SPDT1 4.5Ω 4.5Ω SPDT2 4.5Ω 20Ω V+ 1 NO1 2 MAX4717/MAX4718 10 NO2 9 8 7 6 µMAX COM2 IN2 NC2 GND MAX4717/MAX4718 COM2 NO2 IN_ 0 C4 B4 V+ UCSP A4 1 NO_ OFF ON NC_ ON OFF COM1 3 IN1 4 NC1 5 SWITCHES SHOWN FOR LOGIC "0" INPUT ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/MAX4718 ABSOLUTE MAXIMUM RATINGS (All Voltages Referenced to GND) V+, IN_...................................................................-0.3V to +6.0V COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V) Continuous Current COM_, NO_, NC_ ...........................±100mA Peak Current COM_, NO_, NC_ (pulsed at 1ms, 10% duty cycle)................................±200mA Continuous Power Dissipation (TA = +70°C) 10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW 12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW ESD Method 3015.7 .............................................................>2kV Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Bump Temperature (soldering) (Note 2) Infrared (15s) ...............................................................+220°C Vapor Phase (60s) .......................................................+215°C Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed u.


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