Socket for Memory Module Board
Socket for Memory Module Board
MCR89 Series
FEM Design Simulation
Designed in Miniature 2 Contacts with High Precision ...
Description
Socket for Memory Module Board
MCR89 Series
FEM Design Simulation
Designed in Miniature 2 Contacts with High Precision Spring
sFeatures
1. High Reliability
This socket achieves high reliability in the horizontal contact spring system.
4. Miniature Type and High Density Mounting
The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density.
2. Low Insertion Force
This socket prevents mis-insertion force in the preload structure.
5. Wide Effective Mounting Area
This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking.
3. Easy Pattern Design
The dip contact through-hole diameter is only Ø0.5, and simplifies the pattern design.
6. Easy Board Mounting
The fixing pins are arranged in the same alignment as the contact, so as to easily install the connector in the board.
7. Accessories
sProduct Specifications
Rating Item 1. Contact Resistance 1000M ohms min. 2. Withstanding voltage No flashover or insulation breakdown. 3. Insulation Resistance 20m ohms max. 4. Vibration No electrical discontinuity of 10 µs or more Current rating: 0.5A
Dust covers and jigs to remove the board are available.
Operating Temperature Range: -30 to +85ç (Note 1) Storage Temperature Range: -10 to +60ç (Note 2) Storage Temperature Range: 40 to 70% (Note 2) Conditions 500A DC 500V DC / 1 minute 100mA Frequency: 10 to 55...
Similar Datasheet