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MC88913D Dataheets PDF



Part Number MC88913D
Manufacturers Motorola
Logo Motorola
Description LOW SKEW CMOS CLOCK DRIVER
Datasheet MC88913D DatasheetMC88913D Datasheet (PDF)

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document from Logic Marketing Low Skew CMOS Clock Driver The MC88913 is a high–speed, low power, hex divide–by–two D–type flip–flop with two inverting and four non–inverting outputs that have closely matched propagation delays. With a TTL compatible buffered clock input that is common to all flip–flops, the MC88913 is ideal for use in high–frequency systems as a clock driver, providing multiple outputs that are synchronous. MC88913 LOW SKEW C.

  MC88913D   MC88913D



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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document from Logic Marketing Low Skew CMOS Clock Driver The MC88913 is a high–speed, low power, hex divide–by–two D–type flip–flop with two inverting and four non–inverting outputs that have closely matched propagation delays. With a TTL compatible buffered clock input that is common to all flip–flops, the MC88913 is ideal for use in high–frequency systems as a clock driver, providing multiple outputs that are synchronous. MC88913 LOW SKEW CMOS CLOCK DRIVER • • • • • • Minimum Clock Input fMAX of 110MHz TTL Compatible Positive Edge–Triggered Clock Matched Outputs for Synchronous Applications Outputs Source/Sink 24mA Part–to–Part Skew of Less Than 4.0ns Guaranteed Rise and Fall Times for a Given Capacitive Load 14 1 Pinout: 14–Lead Plastic (Top View) VCC 14 GND 13 Q5 12 Q4 11 Q3 10 GND 9 GND 8 N SUFFIX PLASTIC PACKAGE CASE 646–06 14 1 D SUFFIX PLASTIC PACKAGE CASE 751A–03 1 GND 2 CLK 3 Q0 4 Q1 5 Q2 6 GND 7 GND MAXIMUM RATINGS* Symbol VCC Vin Vout Iin Iout ICC PD Tstg TL Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Power Dissipation in Still Air Storage Temperature Lead Temperature, 1mm from Case for 10s (Plastic or SOIC Package) Plastic Package** SOIC Package** Value –0.5 to +7.0 –0.5 to VCC + 0.5 –0.5 to VCC + 0.5 ± 20 ± 50 ± 50 750 500 –65 to +150 260 Units V V V mA mA mA mW °C °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. ** Derating: Plastic Package: –10mW/°C from 65°C to 125°C SOIC Package: –7.0mW/°C from 65°C to 125°C 11/93 © Motorola, Inc. 1995 1 REV 3 MC88913 LOGIC DIAGRAM CLK CLK Q D Q CLK D Q CLK D Q CLK D Q CLK D Q CLK D Q Q0 Q1 Q2 Q3 Q4 Q5 NOTE: This diagram is provided only for understanding of logic operation and should not be used to estimate propagation delays RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature Input Rise and Fall Time Vin from 0.8 to 2.0V Vmeas from 0.8 to 2.0V Min 2.0 0 –40 0 0 Max 6.0 VCC +85 10 8.0 Unit V V °C ns/V DC CHARACTERISTICS (unless otherwise specified) Symbol ICC Parameter Maximum Quiescent Supply Current 80 Unit µA Condition VIN = VCC or GND VCC = 5.5V, TA = Worst Case VIN = VCC or GND VCC = 5.5V, TA = 25°C VIN = VCC –2.1V VCC = 5.5V, TA = Worst Case ICC Maximum Quiescent Supply Current 8.0 µA ICCT Maximum Additional ICC/Input 1.5 mA AC OPERATING REQUIREMENTS TA = 25°C CL = 50 pF Symbol tW Parameter CLK Pulse Width (HIGH to LOW) VCC (V) 5.0 Min 3.0 Max TA = –40 to +85°C CL = 50 pF Min 3.0 Max Unit ns CAPACITANCE Symbol CIN CPD Input Capacitance Power Dissipation Cap.


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