Document
MCR106-6, MCR106-8
Preferred Device
Sensitive Gate Silicon Controlled Rectifiers
Reverse Blocking Thyristors
PNPN devices designed for high volume consumer applications such as temperature, light and speed control; process and remote control, and warning systems where reliability of operation is important. • Glass-Passivated Surface for Reliability and Uniformity • Power Rated at Economical Prices • Practical Level Triggering and Holding Characteristics • Flat, Rugged, Thermopad Construction for Low Thermal Resistance, High Heat Dissipation and Durability • Device Marking: Device Type, e.g., MCR106–6, Date Code
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating Peak Repetitive Off–State Voltage(1) (TJ = –40 to 110°C, Sine Wave 50 to 60 Hz, Gate Open) MCR106–6 MCR106–8 On-State RMS Current (TC = 93°C) (180° Conduction Angles) Average On–State Current (180° Conduction Angles; TC = 93°C) Peak Non-repetitive Surge Current (1/2 Cycle, Sine Wave 60 Hz, TJ = 110°C) Circuit Fusing Considerations (t = 8.3 ms) Forward Peak Gate Power (TC = 93°C, Pulse Width Symbol VDRM, VRRM 400 600 IT(RMS) IT(AV) ITSM 4.0 2.55 25 Amps Amps Amps 3 Value Unit Volts A
http://onsemi.com
SCRs 4 AMPERES RMS 400 thru 600 VOLTS
G K
2 1
I2t PGM PG(AV) IGM VRGM TJ Tstg —
2.6 0.5 0.1 0.2 6.0 –40 to +110 –40 to +150 6.0
A2s Watt Watt 1 Amp Volts °C °C in. lb. 2 3
v 1.0 µs) v 1.0 µs) v 1.0 µs)
TO–225AA (formerly TO–126) CASE 077 STYLE 2
Forward Average Gate Power (TC = 93°C, t = 8.3 ms) Forward Peak Gate Current (TC = 93°C, Pulse Width
PIN ASSIGNMENT
Cathode Anode Gate
Peak Reverse Gate Voltage (TC = 93°C, Pulse Width
ORDERING INFORMATION
Device MCR106–6 MCR106–8 Package TO225AA TO225AA Shipping 500/Box 500/Box
Operating Junction Temperature Range Storage Temperature Range Mounting Torque(2)
(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. (2) Torque rating applies with use of compression washer (B52200-F006 or equivalent). Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common. (See AN209B). For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +200°C. For optimum results, an activated flux (oxide removing) is recommended.
Preferred devices are recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2000
1
May, 2000 – Rev. 3
Publication Order Number: MCR106/D
MCR106–6, MCR106–8
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds S.