Document
MMDT4403
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction • Ideal for Low Power Amplification and Switching • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363 • Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). • Terminal Connections: See Diagram • Marking Information: K2T – See Page 4 • Ordering & Date Code Information: See Page 4 • Weight: 0.006 grams (approximate)
A
C2 B1 E1
BC
E2 B2 C1
H K
J DF C2 B1 E1
L
E2 B2 C1
SOT-363 Dim Min Max
A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 M H 1.80 2.20 J — 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 α 0° 8° All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
(Note 1) (Note 1, 2)
(Note 1)
Symbol VCBO VCEO VEBO IC Pd RθJA
Tj, TSTG
Value -40 -40 -5.0 -600 200 625
-55 to +150
Unit V V V mA
mW °C/W
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Maximum combined dissipation. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30110 Rev. 10 - 2
1 of 4 www.diodes.com
MMDT4403
© Diodes Incorporated
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic OFF CHARACTERISTICS (Note 6) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Base Cutoff Current ON CHARACTERISTICS (Note 6)
Symbol Min
V(BR)CBO V(BR)CEO V(BR)EBO
ICEX IBL
-40 -40 -5.0 ⎯ ⎯
DC Current Gain
30 60 hFE 100 100 20
Collector-Emitter Saturation Voltage
VCE(SAT)
Base-Emitter Saturation Voltage
VBE(SAT)
SMALL SIGNAL CHARACTERISTICS Output Capacitance Input Capacitance Input Impedance Voltage Feedback Ratio Small Signal Current Gain Output Admittance
Ccb Ceb hie hre hfe hoe
Current Gain-Bandwidth Product
fT
SWITCHING CHARACTERISTICS Delay Time Rise Time Storage Time Fall Time
td tr ts tf
Notes: 6. Short duration pulse test used to minimize self-heating effect.
⎯
-0.75 ⎯
⎯ ⎯ 1.5 0.1 60 1.0 200
⎯ ⎯ ⎯ ⎯
Max
⎯ ⎯ ⎯ -100 -100
⎯ ⎯ ⎯ 300 ⎯ -0.40 -.