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MMDT4403 Dataheets PDF



Part Number MMDT4403
Manufacturers Diodes Incorporated
Logo Diodes Incorporated
Description DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Datasheet MMDT4403 DatasheetMMDT4403 Datasheet (PDF)

MMDT4403 DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features • Epitaxial Planar Die Construction • Ideal for Low Power Amplification and Switching • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Note 4 and 5) Mechanical Data • Case: SOT-363 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finis.

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MMDT4403 DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features • Epitaxial Planar Die Construction • Ideal for Low Power Amplification and Switching • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Note 4 and 5) Mechanical Data • Case: SOT-363 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • Terminal Connections: See Diagram • Marking Information: K2T – See Page 4 • Ordering & Date Code Information: See Page 4 • Weight: 0.006 grams (approximate) A C2 B1 E1 BC E2 B2 C1 H K J DF C2 B1 E1 L E2 B2 C1 SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 M H 1.80 2.20 J — 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 α 0° 8° All Dimensions in mm Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range (Note 1) (Note 1, 2) (Note 1) Symbol VCBO VCEO VEBO IC Pd RθJA Tj, TSTG Value -40 -40 -5.0 -600 200 625 -55 to +150 Unit V V V mA mW °C/W °C Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Maximum combined dissipation. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. DS30110 Rev. 10 - 2 1 of 4 www.diodes.com MMDT4403 © Diodes Incorporated Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS (Note 6) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Base Cutoff Current ON CHARACTERISTICS (Note 6) Symbol Min V(BR)CBO V(BR)CEO V(BR)EBO ICEX IBL -40 -40 -5.0 ⎯ ⎯ DC Current Gain 30 60 hFE 100 100 20 Collector-Emitter Saturation Voltage VCE(SAT) Base-Emitter Saturation Voltage VBE(SAT) SMALL SIGNAL CHARACTERISTICS Output Capacitance Input Capacitance Input Impedance Voltage Feedback Ratio Small Signal Current Gain Output Admittance Ccb Ceb hie hre hfe hoe Current Gain-Bandwidth Product fT SWITCHING CHARACTERISTICS Delay Time Rise Time Storage Time Fall Time td tr ts tf Notes: 6. Short duration pulse test used to minimize self-heating effect. ⎯ -0.75 ⎯ ⎯ ⎯ 1.5 0.1 60 1.0 200 ⎯ ⎯ ⎯ ⎯ Max ⎯ ⎯ ⎯ -100 -100 ⎯ ⎯ ⎯ 300 ⎯ -0.40 -.


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