High Brightness Chip LED Lamp
Semiconductor
SR1316-H
High Brightness Chip LED Lamp
Features
• • • • 1.6mm(L)×0.8mm small size surface mount type Thi...
Description
Semiconductor
SR1316-H
High Brightness Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic High luminous
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLR-9010-001
1
SR1316-H
bsolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg
Ratings
65 25 50 4 -25∼80 -30∼100 240℃ for 5 seconds
Unit
mW mA mA V °C °C
* Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile
Temp(℃) Peak Temp max 240℃ 1~ 4℃/sec 220℃ 140~ 160℃ Preheating area 120 1~4℃/sec Time(sec)
Solder area max. 50sec
Peak time max 10sec
-2~ -6℃/sec
Electrical Characteristics
Characteristic
Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current *3Half Angle
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V
Min. Typ. Max.
1.8 8 660 20 ±65 ±70 2.5 10 -
Unit
V mcd nm nm uA deg
λP ∆λ IR
θ1/2
x
Y
IF= 20mA
*3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity
KLR-9010-001
2
SR1316-H
Characteristic Diagrams
Fig. 1 IF - VF Fig. 2 IV - IF
Forward Current IF [mA]
Forward Voltage VF [V]
Luminous Intensity Iv [mcd]
Forward
Current IF [mA]
Fig. 3 IF – Ta
Fig...
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