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NAND256-A Dataheets PDF



Part Number NAND256-A
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description 128 Mbit / 256 Mbit / 512 Mbit / 1 Gbit (x8/x16) 528 Byte/264 Word Page / 1.8V/3V / NAND Flash Memories
Datasheet NAND256-A DatasheetNAND256-A Datasheet (PDF)

NAND128-A, NAND256-A NAND512-A, NAND01G-A 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ HIGH DENSITY NAND FLASH MEMORIES – Up to 1 Gbit memory array – Up to 32 Mbit spare area – Cost effective solutions for mass storage applications NAND INTERFACE – x8 or x16 bus width – Multiplexed Address/ Data – Pinout compatibility for all densities SUPPLY VOLTAGE – 1.8V device: VDD = 1.7 to 1.95V – 3.0V.

  NAND256-A   NAND256-A


Document
NAND128-A, NAND256-A NAND512-A, NAND01G-A 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ HIGH DENSITY NAND FLASH MEMORIES – Up to 1 Gbit memory array – Up to 32 Mbit spare area – Cost effective solutions for mass storage applications NAND INTERFACE – x8 or x16 bus width – Multiplexed Address/ Data – Pinout compatibility for all densities SUPPLY VOLTAGE – 1.8V device: VDD = 1.7 to 1.95V – 3.0V device: VDD = 2.7 to 3.6V PAGE SIZE – x8 device: (512 + 16 spare) Bytes – x16 device: (256 + 8 spare) Words BLOCK SIZE – x8 device: (16K + 512 spare) Bytes – x16 device: (8K + 256 spare) Words PAGE READ / PROGRAM – Random access: 12µs (max) – Sequential access: 50ns (min) – Page program time: 200µs (typ) COPY BACK PROGRAM MODE – Fast page copy without external buffering FAST BLOCK ERASE – Block erase time: 2ms (Typ) STATUS REGISTER ELECTRONIC SIGNATURE CHIP ENABLE ‘DON’T CARE’ OPTION – Simple interface with microcontroller SERIAL NUMBER OPTION HARDWARE DATA PROTECTION – Program/Erase locked during Power transitions Figure 1. Packages TSOP48 12 x 20mm WSOP48 12 x 17 x 0.65mm FBGA VFBGA55 8 x 10 x 1mm TFBGA55 8 x 10 x 1.2mm VFBGA63 8.5 x 15 x 1mm TFBGA63 8.5 x 15 x 1.2mm ■ ■ ■ DATA INTEGRITY – 100,000 Program/Erase cycles – 10 years Data Retention RoHS COMPLIANCE – Lead-Free Components are Compliant with the RoHS Directive DEVELOPMENT TOOLS – Error Correction Code software and hardware models – Bad Blocks Management and Wear Leveling algorithms – File System OS Native reference software – Hardware simulation models December 2004 1/55 NAND128-A, NAND256-A, NAND512-A, NAND01G-A Table 1. Product List Reference Part Number NAND128R3A NAND128W3A NAND128-A NAND128R4A NAND128W4A NAND256R3A NAND256W3A NAND256-A NAND256R4A NAND256W4A NAND512R3A NAND512W3A NAND512-A NAND512R4A NAND512W4A NAND01GR3A NAND01GW3A NAND01G-A NAND01GR4A NAND01GW4A 2/55 NAND128-A, NAND256-A, NAND512-A, NAND01G-A TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2. Figure 2. Table 3. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 TSOP48 and WSOP48 Connections, x8 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 TSOP48 and WSOP48 Connections, x16 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 FBGA55 Connections, x8 devices (Top view through package) . . . . . . . . . . . . . . . . . . . 11 FBGA55 Connections, x16 devices (Top view through package) . . . . . . . . . . . . . . . . . . 12 FBGA63 Connections, x8 devices (Top view through package) . . . . . . . . . . . . . . . . . . . 13 FBGA63 Connections, x16 devices (Top view through package) . . . . . . . . . . . . . . . . . . 14 MEMORY ARRAY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Bad Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 4. Valid Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 10.Memory Array Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Inputs/Outputs (I/O0-I/O7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Inputs/Outputs (I/O8-I/O15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Command Latch Enable (CL) . . . . . . . . . . . . . . . . . .


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