OPR2100L

Product Bulletin OPR2100L August 1996 PRELIMINARY Six Element SMD LED Array Type OPR2100L Features Surface mountable High temperature operation Closely matched emissions Matched to OPR2100 Photodiode Array Absolute Maximum Ratings (Each channel, TA = 25o C unless otherwise noted) Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 V Continous Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Peak Forward Current (1 µA pulse width, 300 pps) . . . . . . . . . . . . . . . . . . . . . . . 1.0 A Storage and Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . -55o C to +125o C Power Dissipation (derate @ 1.00 mW/o C above 25o C) . . . . . . . . . . . . . . . . 100 mW Description Enclosed in a compact polyimide chip carrier, this six element LED has been specifically designed to be used as an illuminating source for the OPR2100. The light is spectrally matched to the responsivity for maximum efficency. The six chips are bonded with common cathodes and individual anodes to allow channel matching. The package can withstand multiple exposures to the most demanding solder conditions. The wrap around solder pads are gold plated for exceptional storage and wetting characteristics. PIN OUT: PIN#1 2 3 4 5 6 7 8 ANODE A ANODE F ANODE E COMMON CATHODE ANODE D ANODE C ANODE B COMMON CATHODE Electrical Characteristics (TA = 25o C unless otherwis...