Chip LED Lamp
Semiconductor
SA1316
Chip LED Lamp
Features
• • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55m...
Description
Semiconductor
SA1316
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLA-9001-001
1
SA1316
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg
Ratings
70 25 50 4 -25∼80 -30∼100
Unit
mW mA mA V °C °C
* Soldering Temperature Tsol 240°C for 5 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100°C to 150°C within 2 minutes Soldering 240°C within 5 seconds Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V
Min
-
Typ
2.0 6 630 35 ±65 ±70
Max
2.8 10 -
Unit
V mcd nm nm uA deg
λP ∆λ IR
θ1/2 X Y
IF= 20mA
KLA-9001-001
2
SA1316
Characteristic Diagrams
Fig. 1 IF - VF Fig. 2 IV - IF
Forward Current IF [mA]
Forward Voltage VF [V]
Luminous Intensity Iv [mcd]
Forward Current IF [mA]
Fig. 3 IF – Ta
Fig.4 Spectrum Distribution
Current IF [mA]
Forward
Relative Intensity [%]
Ambient Temperature Ta [℃]
Wavelength λ [nm]...
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